Intel Celeron M 722 vs Intel Core 2 Duo T5850
Comparative analysis of Intel Celeron M 722 and Intel Core 2 Duo T5850 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron M 722
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 5.7x lower typical power consumption: 5.5 Watt vs 34 Watt
| Manufacturing process technology | 45 nm vs 65 nm |
| Thermal Design Power (TDP) | 5.5 Watt vs 34 Watt |
Reasons to consider the Intel Core 2 Duo T5850
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- Around 75% higher clock speed: 2.1 GHz vs 1.2 GHz
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
| Number of cores | 2 vs 1 |
| Number of threads | 2 vs 1 |
| Maximum frequency | 2.1 GHz vs 1.2 GHz |
| L2 cache | 2 MB vs 1024 KB |
Compare benchmarks
CPU 1: Intel Celeron M 722
CPU 2: Intel Core 2 Duo T5850
| Name | Intel Celeron M 722 | Intel Core 2 Duo T5850 |
|---|---|---|
| PassMark - Single thread mark | 747 | |
| PassMark - CPU mark | 721 | |
| Geekbench 4 - Single Core | 241 | |
| Geekbench 4 - Multi-Core | 430 |
Compare specifications (specs)
| Intel Celeron M 722 | Intel Core 2 Duo T5850 | |
|---|---|---|
Essentials |
||
| Architecture codename | Penryn | Merom |
| Launch date | 1 October 2008 | 1 October 2008 |
| Place in performance rating | not rated | 2977 |
| Processor Number | 722 | |
| Series | Legacy Intel® Celeron® Processor | Intel Core 2 Duo |
| Status | Discontinued | |
| Vertical segment | Mobile | Laptop |
| Price now | $15.90 | |
| Value for money (0-100) | 22.13 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.20 GHz | |
| Bus Speed | 800 MHz FSB | |
| Die size | 107 mm2 | |
| Front-side bus (FSB) | 800 MHz | 667 MHz |
| L1 cache | 64 KB | |
| L2 cache | 1024 KB | 2 MB |
| Manufacturing process technology | 45 nm | 65 nm |
| Maximum core temperature | 105°C | |
| Maximum frequency | 1.2 GHz | 2.1 GHz |
| Number of cores | 1 | 2 |
| Number of threads | 1 | 2 |
| Transistor count | 410 million | |
| VID voltage range | 0.775V - 1.1V | |
Compatibility |
||
| Low Halogen Options Available | ||
| Package Size | 22mm x 22mm | |
| Sockets supported | BGA956 | |
| Thermal Design Power (TDP) | 5.5 Watt | 34 Watt |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||