Intel Celeron ULV 573 vs Intel Xeon Platinum 8176F
Comparative analysis of Intel Celeron ULV 573 and Intel Xeon Platinum 8176F processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals.
Differences
Reasons to consider the Intel Celeron ULV 573
- Around 15% higher maximum core temperature: 100°C vs 87°C
- 17.3x lower typical power consumption: 10 Watt vs 173 Watt
| Maximum core temperature | 100°C vs 87°C |
| Thermal Design Power (TDP) | 10 Watt vs 173 Watt |
Reasons to consider the Intel Xeon Platinum 8176F
- 27 more cores, run more applications at once: 28 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 65 nm
| Number of cores | 28 vs 1 |
| Manufacturing process technology | 14 nm vs 65 nm |
Compare specifications (specs)
| Intel Celeron ULV 573 | Intel Xeon Platinum 8176F | |
|---|---|---|
Essentials |
||
| Architecture codename | Merom | Skylake |
| Launch date | Q3'06 | Q3'17 |
| Place in performance rating | not rated | not rated |
| Processor Number | 573 | 8176F |
| Series | Legacy Intel® Celeron® Processor | Intel® Xeon® Scalable Processors |
| Status | Discontinued | Launched |
| Vertical segment | Mobile | Server |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.00 GHz | 2.10 GHz |
| Bus Speed | 533 MHz FSB | |
| Die size | 143 mm2 | |
| Manufacturing process technology | 65 nm | 14 nm |
| Maximum core temperature | 100°C | 87°C |
| Number of cores | 1 | 28 |
| Transistor count | 291 million | |
| VID voltage range | 0.80V-0.975V | |
| Maximum frequency | 3.80 GHz | |
| Number of threads | 56 | |
| Number of Ultra Path Interconnect (UPI) Links | 2 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | 88.0mm x 56.5mm |
| Sockets supported | PBGA479 | FCLGA3647 |
| Thermal Design Power (TDP) | 10 Watt | 173 Watt |
Security & Reliability |
||
| Intel® Trusted Execution technology (TXT) | ||
| Execute Disable Bit (EDB) | ||
| Intel® Run Sure Technology | ||
| Mode-based Execute Control (MBE) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Intel 64 | ||
| Intel® Turbo Boost technology | ||
| Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | |
| Integrated Intel® Omni-Path Architecture (Intel® OPA) | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® TSX-NI | ||
| Intel® Volume Management Device (VMD) | ||
| Intel® vPro™ Platform Eligibility | ||
| Number of AVX-512 FMA Units | 2 | |
| Speed Shift technology | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
||
| Max memory channels | 6 | |
| Maximum memory size | 768 GB | |
| Supported memory frequency | 2666 MHz | |
| Supported memory types | DDR4-2666 | |
Peripherals |
||
| Max number of PCIe lanes | 48 | |
| PCI Express revision | 3.0 | |
| Scalability | 2S | |
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