Intel Celeron ULV 573 vs Intel Xeon Platinum 8176F

Comparative analysis of Intel Celeron ULV 573 and Intel Xeon Platinum 8176F processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals.

 

Differences

Reasons to consider the Intel Celeron ULV 573

  • Around 15% higher maximum core temperature: 100°C vs 87°C
  • 17.3x lower typical power consumption: 10 Watt vs 173 Watt
Maximum core temperature 100°C vs 87°C
Thermal Design Power (TDP) 10 Watt vs 173 Watt

Reasons to consider the Intel Xeon Platinum 8176F

  • 27 more cores, run more applications at once: 28 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 65 nm
Number of cores 28 vs 1
Manufacturing process technology 14 nm vs 65 nm

Compare specifications (specs)

Intel Celeron ULV 573 Intel Xeon Platinum 8176F

Essentials

Architecture codename Merom Skylake
Launch date Q3'06 Q3'17
Place in performance rating not rated not rated
Processor Number 573 8176F
Series Legacy Intel® Celeron® Processor Intel® Xeon® Scalable Processors
Status Discontinued Launched
Vertical segment Mobile Server

Performance

64 bit support
Base frequency 1.00 GHz 2.10 GHz
Bus Speed 533 MHz FSB
Die size 143 mm2
Manufacturing process technology 65 nm 14 nm
Maximum core temperature 100°C 87°C
Number of cores 1 28
Transistor count 291 million
VID voltage range 0.80V-0.975V
Maximum frequency 3.80 GHz
Number of threads 56
Number of Ultra Path Interconnect (UPI) Links 2

Compatibility

Low Halogen Options Available
Package Size 35mm x 35mm 88.0mm x 56.5mm
Sockets supported PBGA479 FCLGA3647
Thermal Design Power (TDP) 10 Watt 173 Watt

Security & Reliability

Intel® Trusted Execution technology (TXT)
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Mode-based Execute Control (MBE)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Intel 64
Intel® Turbo Boost technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Integrated Intel® Omni-Path Architecture (Intel® OPA)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Memory

Max memory channels 6
Maximum memory size 768 GB
Supported memory frequency 2666 MHz
Supported memory types DDR4-2666

Peripherals

Max number of PCIe lanes 48
PCI Express revision 3.0
Scalability 2S

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