Intel Core 2 Duo E6700 vs Intel Celeron D 346

Comparative analysis of Intel Core 2 Duo E6700 and Intel Celeron D 346 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo E6700

Intel Celeron D 346

Differences

Reasons to consider the Intel Core 2 Duo E6700

1 more cores, run more applications at once: 2 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
Around 29% lower typical power consumption: 65 Watt vs 84 Watt

Number of cores	2 vs 1
Manufacturing process technology	65 nm vs 90 nm
Thermal Design Power (TDP)	65 Watt vs 84 Watt

Reasons to consider the Intel Celeron D 346

Around 13% higher maximum core temperature: 67.7°C vs 60.1°C

Maximum core temperature	67.7°C vs 60.1°C

Compare benchmarks

CPU 1: Intel Core 2 Duo E6700
CPU 2: Intel Celeron D 346

Name	Intel Core 2 Duo E6700	Intel Celeron D 346
PassMark - Single thread mark	1023
PassMark - CPU mark	990
Geekbench 4 - Single Core	317
Geekbench 4 - Multi-Core	564

Compare specifications (specs)

	Intel Core 2 Duo E6700	Intel Celeron D 346
Essentials
Architecture codename	Conroe	Prescott
Launch date	Q3'06	October 2004
Place in performance rating	2712	not rated
Processor Number	E6700	346
Series	Legacy Intel® Core™ Processors	Legacy Intel® Celeron® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.66 GHz	3.06 GHz
Bus Speed	1066 MHz FSB	533 MHz FSB
Die size	143 mm2	112 mm2
Manufacturing process technology	65 nm	90 nm
Maximum core temperature	60.1°C	67.7°C
Number of cores	2	1
Transistor count	291 million	125 million
VID voltage range	0.8500V-1.5V	1.250V-1.400V
L1 cache		16 KB
L2 cache		256 KB
Maximum frequency		3.06 GHz
Compatibility
Low Halogen Options Available
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Scenario Design Power (SDP)	0 W
Sockets supported	PLGA775	PLGA775
Thermal Design Power (TDP)	65 Watt	84 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Memory
Supported memory types		DDR1, DDR2, DDR3