Intel Core 2 Duo L7200 vs Intel Celeron U3405
Comparative analysis of Intel Core 2 Duo L7200 and Intel Celeron U3405 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core 2 Duo L7200
- Around 11% higher maximum core temperature: 100°C vs 90°C
- Around 6% lower typical power consumption: 17 Watt vs 18 Watt
Maximum core temperature | 100°C vs 90°C |
Thermal Design Power (TDP) | 17 Watt vs 18 Watt |
Reasons to consider the Intel Celeron U3405
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Manufacturing process technology | 32 nm vs 65 nm |
Compare benchmarks
CPU 1: Intel Core 2 Duo L7200
CPU 2: Intel Celeron U3405
PassMark - CPU mark |
|
|
Name | Intel Core 2 Duo L7200 | Intel Celeron U3405 |
---|---|---|
PassMark - Single thread mark | 0 | 0 |
PassMark - CPU mark | 684 | 684 |
Compare specifications (specs)
Intel Core 2 Duo L7200 | Intel Celeron U3405 | |
---|---|---|
Essentials |
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Architecture codename | Merom | Arrandale |
Launch date | Q1'07 | Q1'10 |
Place in performance rating | 3324 | 3325 |
Processor Number | L7200 | U3405 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Celeron® Processor |
Status | Discontinued | Launched |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 1.33 GHz | 1.06 GHz |
Bus Speed | 667 MHz FSB | 2.5 GT/s DMI |
Die size | 143 mm2 | 81 mm2 |
Manufacturing process technology | 65 nm | 32 nm |
Maximum core temperature | 100°C | 90°C |
Number of cores | 2 | 2 |
Transistor count | 291 million | 382 million |
VID voltage range | 0.9V-1.1V | |
Number of threads | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 35mm x 35mm | BGA 34mmX28mm |
Sockets supported | PBGA479 | BGA1288 |
Thermal Design Power (TDP) | 17 Watt | 18 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 17.1 GB/s | |
Maximum memory size | 8 GB | |
Supported memory types | DDR3 800/1066 | |
Graphics |
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Graphics base frequency | 166 MHz | |
Graphics max dynamic frequency | 500 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8 |