Intel Core 2 Duo L7200 vs Intel Atom E660
Comparative analysis of Intel Core 2 Duo L7200 and Intel Atom E660 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core 2 Duo L7200
- 1 more cores, run more applications at once: 2 vs 1
- Around 11% higher maximum core temperature: 100°C vs 90°C
- 2.5x better performance in PassMark - CPU mark: 684 vs 271
| Specifications (specs) | |
| Number of cores | 2 vs 1 |
| Maximum core temperature | 100°C vs 90°C |
| Benchmarks | |
| PassMark - CPU mark | 684 vs 271 |
Reasons to consider the Intel Atom E660
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 4.3x lower typical power consumption: 3.6 Watt vs 17 Watt
| Manufacturing process technology | 45 nm vs 65 nm |
| Thermal Design Power (TDP) | 3.6 Watt vs 17 Watt |
Compare benchmarks
CPU 1: Intel Core 2 Duo L7200
CPU 2: Intel Atom E660
| PassMark - CPU mark |
|
|
| Name | Intel Core 2 Duo L7200 | Intel Atom E660 |
|---|---|---|
| PassMark - Single thread mark | 0 | 0 |
| PassMark - CPU mark | 684 | 271 |
Compare specifications (specs)
| Intel Core 2 Duo L7200 | Intel Atom E660 | |
|---|---|---|
Essentials |
||
| Architecture codename | Merom | Tunnel Creek |
| Launch date | Q1'07 | September 2010 |
| Place in performance rating | 3333 | 3340 |
| Processor Number | L7200 | E660 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel Atom® Processors |
| Status | Discontinued | Launched |
| Vertical segment | Mobile | Embedded |
| Launch price (MSRP) | $54 | |
| Price now | $54 | |
| Value for money (0-100) | 1.48 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.33 GHz | 1.30 GHz |
| Bus Speed | 667 MHz FSB | 2500 MHz PCIE |
| Die size | 143 mm2 | 26 mm |
| Manufacturing process technology | 65 nm | 45 nm |
| Maximum core temperature | 100°C | 90°C |
| Number of cores | 2 | 1 |
| Transistor count | 291 million | 47 million |
| VID voltage range | 0.9V-1.1V | VCC (0.75 - 0.9V), VNN (0.75 - 1.1V) |
| L1 cache | 64 KB (per core) | |
| L2 cache | 512 KB (per core) | |
| Maximum frequency | 1.3 GHz | |
| Number of threads | 2 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | 22mmx22mm |
| Sockets supported | PBGA479 | FCBGA676 |
| Thermal Design Power (TDP) | 17 Watt | 3.6 Watt |
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
||
| Max memory channels | 1 | |
| Maximum memory size | 2 GB | |
| Supported memory types | DDR2 800 | |
Graphics |
||
| Graphics base frequency | 400 MHz | |
| Processor graphics | Integrated | |
Peripherals |
||
| Max number of PCIe lanes | 4 | |
| PCI Express revision | 1.0a | |
| PCIe configurations | x1, root complex only | |