Intel Core 2 Duo T5470 vs Intel Core i7-680UM

Comparative analysis of Intel Core 2 Duo T5470 and Intel Core i7-680UM processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo T5470

Intel Core i7-680UM

Differences

Reasons to consider the Intel Core i7-680UM

Around 5% higher maximum core temperature: 105°C vs 100°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 94% lower typical power consumption: 18 Watt vs 35 Watt
Around 43% better performance in PassMark - Single thread mark: 911 vs 636
2x better performance in PassMark - CPU mark: 1196 vs 590

Specifications (specs)
Maximum core temperature	105°C vs 100°C
Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	18 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark	911 vs 636
PassMark - CPU mark	1196 vs 590

Compare benchmarks

CPU 1: Intel Core 2 Duo T5470
CPU 2: Intel Core i7-680UM

PassMark - Single thread mark

CPU 1

CPU 2

636

911

PassMark - CPU mark

CPU 1

CPU 2

590

1196

Name	Intel Core 2 Duo T5470	Intel Core i7-680UM
PassMark - Single thread mark	636	911
PassMark - CPU mark	590	1196
Geekbench 4 - Single Core	1096
Geekbench 4 - Multi-Core	1671

Compare specifications (specs)

	Intel Core 2 Duo T5470	Intel Core i7-680UM
Essentials
Architecture codename	Merom	Arrandale
Place in performance rating	2400	2392
Processor Number	T5470	i7-680UM
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Launch date		26 September 2010
Launch price (MSRP)		$317
Performance
64 bit support
Base frequency	1.60 GHz	1.46 GHz
Bus Speed	800 MHz FSB	2.5 GT/s DMI
Die size	143 mm2	81 mm2
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	100°C	105°C
Number of cores	2	2
Transistor count	291 million	382 million
VID voltage range	1.075V-1.250V
Front-side bus (FSB)		2500 MHz
L2 cache		512 KB
L3 cache		4 MB
Maximum frequency		2.53 GHz
Number of threads		4
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	BGA 34mm x 28mm
Sockets supported	PPGA478	BGA1288
Thermal Design Power (TDP)	35 Watt	18 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)		36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
Max memory channels		2
Maximum memory bandwidth		12.8 GB/s
Maximum memory size		8 GB
Supported memory types		DDR3 800
Graphics
Graphics base frequency		166 MHz
Graphics max dynamic frequency		500 MHz
Graphics max frequency		500 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics		Intel HD Graphics
Graphics interfaces
Number of displays supported		2
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0
PCIe configurations		1x16