Intel Core 2 Extreme QX9770 vs Intel Core 2 Extreme QX9650

Comparative analysis of Intel Core 2 Extreme QX9770 and Intel Core 2 Extreme QX9650 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.

Intel Core 2 Extreme QX9770

Intel Core 2 Extreme QX9650

Differences

Reasons to consider the Intel Core 2 Extreme QX9770

CPU is newer: launch date 3 month(s) later
Around 7% higher clock speed: 3.2 GHz vs 3 GHz
5x better performance in Geekbench 4 - Single Core: 2338 vs 465
4.6x better performance in Geekbench 4 - Multi-Core: 6682 vs 1463

Specifications (specs)
Launch date	March 2008 vs November 2007
Maximum frequency	3.2 GHz vs 3 GHz
Benchmarks
Geekbench 4 - Single Core	2338 vs 465
Geekbench 4 - Multi-Core	6682 vs 1463

Reasons to consider the Intel Core 2 Extreme QX9650

Around 16% higher maximum core temperature: 64.5°C vs 55.5°C
Around 5% lower typical power consumption: 130 Watt vs 136 Watt

Maximum core temperature	64.5°C vs 55.5°C
Thermal Design Power (TDP)	130 Watt vs 136 Watt

Compare benchmarks

CPU 1: Intel Core 2 Extreme QX9770
CPU 2: Intel Core 2 Extreme QX9650

Geekbench 4 - Single Core

CPU 1

CPU 2

2338

465

Geekbench 4 - Multi-Core

CPU 1

CPU 2

6682

1463

Name	Intel Core 2 Extreme QX9770	Intel Core 2 Extreme QX9650
Geekbench 4 - Single Core	2338	465
Geekbench 4 - Multi-Core	6682	1463
3DMark Fire Strike - Physics Score		4864

Compare specifications (specs)

	Intel Core 2 Extreme QX9770	Intel Core 2 Extreme QX9650
Essentials
Architecture codename	Yorkfield	Yorkfield
Launch date	March 2008	November 2007
Place in performance rating	812	2283
Processor Number	QX9770	QX9650
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.20 GHz	3.00 GHz
Bus Speed	1600 MHz FSB	1333 MHz FSB
Die size	214 mm2	214 mm2
L1 cache	256 KB	256 KB
L2 cache	12288 KB	12288 KB
Manufacturing process technology	45 nm	45 nm
Maximum case temperature (TCase)	55 °C	64 °C
Maximum core temperature	55.5°C	64.5°C
Maximum frequency	3.2 GHz	3 GHz
Number of cores	4	4
Transistor count	820 million	820 million
Unlocked
VID voltage range	0.8500V-1.3625V	0.8500V-1.3625V
Memory
Supported memory types	DDR1, DDR2, DDR3	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	LGA775	LGA775
Thermal Design Power (TDP)	136 Watt	130 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)