Intel Core 2 Quad Q8200s vs Intel Celeron Dual-Core T1700
Comparative analysis of Intel Core 2 Quad Q8200s and Intel Celeron Dual-Core T1700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core 2 Quad Q8200s
- 2 more cores, run more applications at once: 4 vs 2
- Around 27% higher clock speed: 2.33 GHz vs 1.83 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
| Number of cores | 4 vs 2 |
| Maximum frequency | 2.33 GHz vs 1.83 GHz |
| Manufacturing process technology | 45 nm vs 65 nm |
| L2 cache | 4096 KB vs 1024 KB |
Reasons to consider the Intel Celeron Dual-Core T1700
- Around 31% higher maximum core temperature: 100°C vs 76.3°C
- Around 86% lower typical power consumption: 35 Watt vs 65 Watt
| Maximum core temperature | 100°C vs 76.3°C |
| Thermal Design Power (TDP) | 35 Watt vs 65 Watt |
Compare benchmarks
CPU 1: Intel Core 2 Quad Q8200s
CPU 2: Intel Celeron Dual-Core T1700
| Name | Intel Core 2 Quad Q8200s | Intel Celeron Dual-Core T1700 |
|---|---|---|
| PassMark - Single thread mark | 0 | |
| PassMark - CPU mark | 1058 |
Compare specifications (specs)
| Intel Core 2 Quad Q8200s | Intel Celeron Dual-Core T1700 | |
|---|---|---|
Essentials |
||
| Architecture codename | Yorkfield | Merom |
| Launch date | January 2009 | 7 December 2008 |
| Place in performance rating | not rated | 3332 |
| Processor Number | Q8200S | T1700 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Celeron® Processor |
| Status | Discontinued | Discontinued |
| Vertical segment | Desktop | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.33 GHz | 1.83 GHz |
| Bus Speed | 1333 MHz FSB | 667 MHz FSB |
| Die size | 164 mm2 | 143 mm2 |
| L1 cache | 256 KB | |
| L2 cache | 4096 KB | 1024 KB |
| Manufacturing process technology | 45 nm | 65 nm |
| Maximum case temperature (TCase) | 76 °C | |
| Maximum core temperature | 76.3°C | 100°C |
| Maximum frequency | 2.33 GHz | 1.83 GHz |
| Number of cores | 4 | 2 |
| Transistor count | 456 million | 291 million |
| VID voltage range | 0.8500V-1.3625V | 1.075V-1.175V |
| Front-side bus (FSB) | 667 MHz | |
| Number of threads | 2 | |
Memory |
||
| Supported memory types | DDR1, DDR2, DDR3 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | 35mm x 35mm |
| Sockets supported | LGA775 | PPGA478 |
| Thermal Design Power (TDP) | 65 Watt | 35 Watt |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||