Intel Core 2 Quad Q8200s vs Intel Celeron Dual-Core T1700
Comparative analysis of Intel Core 2 Quad Q8200s and Intel Celeron Dual-Core T1700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core 2 Quad Q8200s
- 2 more cores, run more applications at once: 4 vs 2
- Around 27% higher clock speed: 2.33 GHz vs 1.83 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Number of cores | 4 vs 2 |
Maximum frequency | 2.33 GHz vs 1.83 GHz |
Manufacturing process technology | 45 nm vs 65 nm |
L2 cache | 4096 KB vs 1024 KB |
Reasons to consider the Intel Celeron Dual-Core T1700
- Around 31% higher maximum core temperature: 100°C vs 76.3°C
- Around 86% lower typical power consumption: 35 Watt vs 65 Watt
Maximum core temperature | 100°C vs 76.3°C |
Thermal Design Power (TDP) | 35 Watt vs 65 Watt |
Compare benchmarks
CPU 1: Intel Core 2 Quad Q8200s
CPU 2: Intel Celeron Dual-Core T1700
Name | Intel Core 2 Quad Q8200s | Intel Celeron Dual-Core T1700 |
---|---|---|
PassMark - Single thread mark | 0 | |
PassMark - CPU mark | 1058 |
Compare specifications (specs)
Intel Core 2 Quad Q8200s | Intel Celeron Dual-Core T1700 | |
---|---|---|
Essentials |
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Architecture codename | Yorkfield | Merom |
Launch date | January 2009 | 7 December 2008 |
Place in performance rating | not rated | 3323 |
Processor Number | Q8200S | T1700 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Celeron® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Mobile |
Performance |
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64 bit support | ||
Base frequency | 2.33 GHz | 1.83 GHz |
Bus Speed | 1333 MHz FSB | 667 MHz FSB |
Die size | 164 mm2 | 143 mm2 |
L1 cache | 256 KB | |
L2 cache | 4096 KB | 1024 KB |
Manufacturing process technology | 45 nm | 65 nm |
Maximum case temperature (TCase) | 76 °C | |
Maximum core temperature | 76.3°C | 100°C |
Maximum frequency | 2.33 GHz | 1.83 GHz |
Number of cores | 4 | 2 |
Transistor count | 456 million | 291 million |
VID voltage range | 0.8500V-1.3625V | 1.075V-1.175V |
Front-side bus (FSB) | 667 MHz | |
Number of threads | 2 | |
Memory |
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Supported memory types | DDR1, DDR2, DDR3 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | 35mm x 35mm |
Sockets supported | LGA775 | PPGA478 |
Thermal Design Power (TDP) | 65 Watt | 35 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |