Intel Core Duo T2300 vs Intel Pentium D 950

Comparative analysis of Intel Core Duo T2300 and Intel Pentium D 950 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core Duo T2300

Intel Pentium D 950

Differences

Reasons to consider the Intel Core Duo T2300

4.2x lower typical power consumption: 31 Watt vs 130 Watt

Thermal Design Power (TDP)	31 Watt vs 130 Watt

Reasons to consider the Intel Pentium D 950

Around 105% higher clock speed: 3.4 GHz vs 1.66 GHz
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 37% better performance in PassMark - Single thread mark: 695 vs 509
2.1x better performance in PassMark - CPU mark: 681 vs 325

Specifications (specs)
Maximum frequency	3.4 GHz vs 1.66 GHz
L2 cache	4096 KB vs 2048 KB
Max number of CPUs in a configuration	2 vs 1
Benchmarks
PassMark - Single thread mark	695 vs 509
PassMark - CPU mark	681 vs 325

Compare benchmarks

CPU 1: Intel Core Duo T2300
CPU 2: Intel Pentium D 950

PassMark - Single thread mark

CPU 1

CPU 2

509

695

PassMark - CPU mark

CPU 1

CPU 2

325

681

Name	Intel Core Duo T2300	Intel Pentium D 950
PassMark - Single thread mark	509	695
PassMark - CPU mark	325	681
Geekbench 4 - Single Core		220
Geekbench 4 - Multi-Core		389

Compare specifications (specs)

	Intel Core Duo T2300	Intel Pentium D 950
Essentials
Architecture codename	Yonah	Presler
Launch date	January 2006	January 2006
Place in performance rating	3005	3051
Processor Number	T2300	950
Series	Legacy Intel® Core™ Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Mobile	Desktop
Performance
64 bit support
Base frequency	1.66 GHz	3.40 GHz
Bus Speed	667 MHz FSB	800 MHz FSB
Die size	90 mm2	162 mm2
Front-side bus (FSB)	667 MHz
L2 cache	2048 KB	4096 KB
Manufacturing process technology	65 nm	65 nm
Maximum core temperature	100°C	C1+D0=63.4°C, B1=68.6°C
Maximum frequency	1.66 GHz	3.4 GHz
Number of cores	2	2
Number of threads	2
Transistor count	151 million	376 million
VID voltage range	1.1625V - 1.30V	1.200V-1.3375V
L1 cache		28 KB
Memory
Supported memory types	DDR1	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	2
Package Size	35mm x 35mm	37.5mm x 37.5mm
Scenario Design Power (SDP)	0 W
Sockets supported	PPGA478, PBGA479	PLGA775
Thermal Design Power (TDP)	31 Watt	130 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	32-bit	32-bit
Intel® AES New Instructions
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)