Intel Core M-5Y10 vs Intel Celeron Dual-Core T3100
Comparative analysis of Intel Core M-5Y10 and Intel Celeron Dual-Core T3100 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core M-5Y10
- CPU is newer: launch date 5 year(s) 0 month(s) later
- 2 more threads: 4 vs 2
- Around 5% higher clock speed: 2.00 GHz vs 1.9 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- 7x lower typical power consumption: 4.5 Watt vs 35 Watt
- Around 28% better performance in PassMark - Single thread mark: 976 vs 765
- Around 41% better performance in PassMark - CPU mark: 1644 vs 1168
Specifications (specs) | |
Launch date | 5 September 2014 vs 1 September 2009 |
Number of threads | 4 vs 2 |
Maximum frequency | 2.00 GHz vs 1.9 GHz |
Manufacturing process technology | 14 nm vs 45 nm |
Thermal Design Power (TDP) | 4.5 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 976 vs 765 |
PassMark - CPU mark | 1644 vs 1168 |
Reasons to consider the Intel Celeron Dual-Core T3100
- Around 11% higher maximum core temperature: 105°C vs 95 °C
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.4x better performance in Geekbench 4 - Single Core: 1108 vs 471
- Around 78% better performance in Geekbench 4 - Multi-Core: 1731 vs 970
Specifications (specs) | |
Maximum core temperature | 105°C vs 95 °C |
L2 cache | 1024 KB vs 512 KB |
Benchmarks | |
Geekbench 4 - Single Core | 1108 vs 471 |
Geekbench 4 - Multi-Core | 1731 vs 970 |
Compare benchmarks
CPU 1: Intel Core M-5Y10
CPU 2: Intel Celeron Dual-Core T3100
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core M-5Y10 | Intel Celeron Dual-Core T3100 |
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PassMark - Single thread mark | 976 | 765 |
PassMark - CPU mark | 1644 | 1168 |
Geekbench 4 - Single Core | 471 | 1108 |
Geekbench 4 - Multi-Core | 970 | 1731 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 5.013 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 22.916 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.262 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.424 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 12.696 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 844 | |
GFXBench 4.0 - Manhattan (Frames) | 1554 | |
GFXBench 4.0 - T-Rex (Frames) | 2526 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 844 | |
GFXBench 4.0 - Manhattan (Fps) | 1554 | |
GFXBench 4.0 - T-Rex (Fps) | 2526 |
Compare specifications (specs)
Intel Core M-5Y10 | Intel Celeron Dual-Core T3100 | |
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Essentials |
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Architecture codename | Broadwell | Penryn |
Launch date | 5 September 2014 | 1 September 2009 |
Place in performance rating | 2310 | 2307 |
Processor Number | 5Y10 | T3100 |
Series | 5th Generation Intel® Core™ M Processors | Legacy Intel® Celeron® Processor |
Status | Launched | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 800 MHz | 1.90 GHz |
Die size | 82 mm | 107 mm2 |
L1 cache | 128 KB | 128 KB |
L2 cache | 512 KB | 1024 KB |
L3 cache | 4 MB | |
Manufacturing process technology | 14 nm | 45 nm |
Maximum core temperature | 95 °C | 105°C |
Maximum frequency | 2.00 GHz | 1.9 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | 2 |
Transistor count | 1300 Million | 410 million |
Bus Speed | 800 MHz FSB | |
Front-side bus (FSB) | 800 MHz | |
VID voltage range | 1.00V-1.250V | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 16 GB | |
Supported memory types | LPDDR3 1333/1600; DDR3L/DDR3L-RS 1600 | |
Graphics |
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Device ID | 0x161E | |
Graphics base frequency | 100 MHz | |
Graphics max dynamic frequency | 800 MHz | |
Graphics max frequency | 800 MHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 16 GB | |
Processor graphics | Intel® HD Graphics 5300 | |
Graphics interfaces |
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DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 2560x1600@60Hz | |
Max resolution over HDMI 1.4 | 2560x1600@60Hz | |
Graphics API support |
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DirectX | 11.2/12 | |
OpenGL | 4.3 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 30mm x 16.5mm | 35mm |
Sockets supported | BGA | PGA478, BGA479 |
Thermal Design Power (TDP) | 4.5 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 12 | |
PCI Express revision | 2.0 | |
PCIe configurations | x1 (6), x2 (4), x4 (3) | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Smart Response technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Intel® Demand Based Switching | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |