Intel Core i3-2332M vs Intel Core 2 Duo T5900

Comparative analysis of Intel Core i3-2332M and Intel Core 2 Duo T5900 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core i3-2332M

Intel Core 2 Duo T5900

Differences

Reasons to consider the Intel Core i3-2332M

CPU is newer: launch date 2 year(s) 11 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 22% better performance in PassMark - Single thread mark: 936 vs 768
2.1x better performance in PassMark - CPU mark: 1353 vs 652

Specifications (specs)
Launch date	September 2011 vs 1 October 2008
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	936 vs 768
PassMark - CPU mark	1353 vs 652

Reasons to consider the Intel Core 2 Duo T5900

4x more L2 cache, more data can be stored in the L2 cache for quick access later

L2 cache	2048 KB vs 256 KB (per core)

Compare benchmarks

CPU 1: Intel Core i3-2332M
CPU 2: Intel Core 2 Duo T5900

PassMark - Single thread mark

CPU 1

CPU 2

936

768

PassMark - CPU mark

CPU 1

CPU 2

1353

652

Name	Intel Core i3-2332M	Intel Core 2 Duo T5900
PassMark - Single thread mark	936	768
PassMark - CPU mark	1353	652
Geekbench 4 - Single Core		1139
Geekbench 4 - Multi-Core		1795

Compare specifications (specs)

	Intel Core i3-2332M	Intel Core 2 Duo T5900
Essentials
Architecture codename	Sandy Bridge	Merom
Launch date	September 2011	1 October 2008
Place in performance rating	2361	2290
Vertical segment	Laptop	Laptop
Series		Intel Core 2 Duo
Performance
64 bit support
Die size	149 mm
L1 cache	64 KB (per core)	128 KB
L2 cache	256 KB (per core)	2048 KB
L3 cache	3072 KB (shared)
Manufacturing process technology	32 nm	65 nm
Maximum frequency	2.2 GHz	2.2 GHz
Number of cores	2	2
Transistor count	624 million
Front-side bus (FSB)		800 MHz
Number of threads		2
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	G2 (988B)	Socket P
Thermal Design Power (TDP)	35 Watt	35 Watt
Advanced Technologies
Intel® Advanced Vector Extensions (AVX)
Intel® Hyper-Threading technology
Enhanced Intel SpeedStep® technology
Intel® Active Management technology (AMT)
Security & Reliability
Intel® Trusted Execution technology (TXT)