Intel Core i3-2370M vs Intel Core 2 Duo E8200
Comparative analysis of Intel Core i3-2370M and Intel Core 2 Duo E8200 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-2370M
- CPU is newer: launch date 3 year(s) 11 month(s) later
- Around 17% higher maximum core temperature: 85C (PGA); 100C (BGA) vs 72.4°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 86% lower typical power consumption: 35 Watt vs 65 Watt
- Around 19% better performance in PassMark - CPU mark: 1359 vs 1140
- Around 13% better performance in Geekbench 4 - Single Core: 414 vs 368
- Around 44% better performance in Geekbench 4 - Multi-Core: 882 vs 612
- 3.1x better performance in CompuBench 1.5 Desktop - Face Detection (mPixels/s): 0.991 vs 0.322
- Around 35% better performance in CompuBench 1.5 Desktop - T-Rex (Frames/s): 0.135 vs 0.1
- Around 2% better performance in CompuBench 1.5 Desktop - Video Composition (Frames/s): 0.701 vs 0.685
| Specifications (specs) | |
| Launch date | 1 January 2012 vs January 2008 |
| Maximum core temperature | 85C (PGA); 100C (BGA) vs 72.4°C |
| Manufacturing process technology | 32 nm vs 45 nm |
| Thermal Design Power (TDP) | 35 Watt vs 65 Watt |
| Benchmarks | |
| PassMark - CPU mark | 1359 vs 1140 |
| Geekbench 4 - Single Core | 414 vs 368 |
| Geekbench 4 - Multi-Core | 882 vs 612 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.991 vs 0.322 |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.135 vs 0.1 |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.701 vs 0.685 |
Reasons to consider the Intel Core 2 Duo E8200
- Around 11% higher clock speed: 2.67 GHz vs 2.4 GHz
- 12x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 10% better performance in PassMark - Single thread mark: 1145 vs 1045
- Around 50% better performance in CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s): 27.206 vs 18.096
- Around 52% better performance in CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s): 2.463 vs 1.623
| Specifications (specs) | |
| Maximum frequency | 2.67 GHz vs 2.4 GHz |
| L2 cache | 6144 KB vs 512 KB |
| Benchmarks | |
| PassMark - Single thread mark | 1145 vs 1045 |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 27.206 vs 18.096 |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.463 vs 1.623 |
Compare benchmarks
CPU 1: Intel Core i3-2370M
CPU 2: Intel Core 2 Duo E8200
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| CompuBench 1.5 Desktop - Face Detection (mPixels/s) |
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| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) |
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| CompuBench 1.5 Desktop - T-Rex (Frames/s) |
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| CompuBench 1.5 Desktop - Video Composition (Frames/s) |
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| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) |
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| Name | Intel Core i3-2370M | Intel Core 2 Duo E8200 |
|---|---|---|
| PassMark - Single thread mark | 1045 | 1145 |
| PassMark - CPU mark | 1359 | 1140 |
| Geekbench 4 - Single Core | 414 | 368 |
| Geekbench 4 - Multi-Core | 882 | 612 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.991 | 0.322 |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 18.096 | 27.206 |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.135 | 0.1 |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.701 | 0.685 |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.623 | 2.463 |
Compare specifications (specs)
| Intel Core i3-2370M | Intel Core 2 Duo E8200 | |
|---|---|---|
Essentials |
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| Architecture codename | Sandy Bridge | Wolfdale |
| Launch date | 1 January 2012 | January 2008 |
| Launch price (MSRP) | $225 | |
| Place in performance rating | 3097 | 3105 |
| Price now | $39.81 | $49.99 |
| Processor Number | i3-2370M | E8200 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Value for money (0-100) | 20.53 | 11.13 |
| Vertical segment | Mobile | Desktop |
Performance |
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| 64 bit support | ||
| Base frequency | 2.40 GHz | 2.66 GHz |
| Bus Speed | 5 GT/s DMI | 1333 MHz FSB |
| Die size | 149 mm | 107 mm2 |
| L1 cache | 128 KB | 128 KB |
| L2 cache | 512 KB | 6144 KB |
| L3 cache | 3072 KB | |
| Manufacturing process technology | 32 nm | 45 nm |
| Maximum core temperature | 85C (PGA); 100C (BGA) | 72.4°C |
| Maximum frequency | 2.4 GHz | 2.67 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | |
| Transistor count | 624 Million | 410 million |
| Maximum case temperature (TCase) | 72 °C | |
| VID voltage range | 0.8500V-1.3625V | |
Memory |
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| Max memory channels | 2 | |
| Maximum memory bandwidth | 21.3 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3 1066/1333 | DDR1, DDR2, DDR3 |
Graphics |
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| Device ID | 0x116 | |
| Graphics base frequency | 650 MHz | |
| Graphics max dynamic frequency | 1.15 GHz | |
| Graphics max frequency | 1.15 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 3000 | |
Graphics interfaces |
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| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023) | 37.5mm x 37.5mm |
| Sockets supported | PPGA988 | LGA775 |
| Thermal Design Power (TDP) | 35 Watt | 65 Watt |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| FSB parity | ||
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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