Intel Core i3-2375M vs Intel Core 2 Duo T7200
Comparative analysis of Intel Core i3-2375M and Intel Core 2 Duo T7200 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-2375M
- CPU is newer: launch date 6 year(s) 6 month(s) later
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x lower typical power consumption: 17 Watt vs 34 Watt
- Around 21% better performance in PassMark - CPU mark: 903 vs 744
- Around 2% better performance in Geekbench 4 - Single Core: 254 vs 250
- Around 37% better performance in Geekbench 4 - Multi-Core: 579 vs 422
Specifications (specs) | |
Launch date | 3 February 2013 vs 28 July 2006 |
Number of threads | 4 vs 2 |
Manufacturing process technology | 32 nm vs 65 nm |
L1 cache | 128 KB vs 64 KB |
Thermal Design Power (TDP) | 17 Watt vs 34 Watt |
Benchmarks | |
PassMark - CPU mark | 903 vs 744 |
Geekbench 4 - Single Core | 254 vs 250 |
Geekbench 4 - Multi-Core | 579 vs 422 |
Reasons to consider the Intel Core 2 Duo T7200
- Around 33% higher clock speed: 2 GHz vs 1.5 GHz
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 7% better performance in PassMark - Single thread mark: 744 vs 693
Specifications (specs) | |
Maximum frequency | 2 GHz vs 1.5 GHz |
L2 cache | 4096 KB vs 512 KB |
Benchmarks | |
PassMark - Single thread mark | 744 vs 693 |
Compare benchmarks
CPU 1: Intel Core i3-2375M
CPU 2: Intel Core 2 Duo T7200
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i3-2375M | Intel Core 2 Duo T7200 |
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PassMark - Single thread mark | 693 | 744 |
PassMark - CPU mark | 903 | 744 |
Geekbench 4 - Single Core | 254 | 250 |
Geekbench 4 - Multi-Core | 579 | 422 |
Compare specifications (specs)
Intel Core i3-2375M | Intel Core 2 Duo T7200 | |
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Essentials |
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Architecture codename | Sandy Bridge | Merom |
Launch date | 3 February 2013 | 28 July 2006 |
Launch price (MSRP) | $250 | $286 |
Place in performance rating | 2980 | 2974 |
Processor Number | i3-2375M | T7200 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Launched | Discontinued |
Vertical segment | Mobile | Mobile |
Price now | $99.95 | |
Value for money (0-100) | 3.44 | |
Performance |
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64 bit support | ||
Base frequency | 1.50 GHz | 2.00 GHz |
Bus Speed | 5 GT/s DMI | 667 MHz FSB |
Die size | 149 mm | 143 mm2 |
L1 cache | 128 KB | 64 KB |
L2 cache | 512 KB | 4096 KB |
L3 cache | 3072 KB | |
Manufacturing process technology | 32 nm | 65 nm |
Maximum core temperature | 100 °C | 100°C |
Maximum frequency | 1.5 GHz | 2 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | 2 |
Transistor count | 624 Million | 291 million |
Front-side bus (FSB) | 667 MHz | |
VID voltage range | 1.0375V-1.300V | |
Memory |
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Max memory channels | 2 | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3 1066/1333 | |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 31.0mm x 24.0mm (BGA1023) | 35mm x 35mm |
Sockets supported | FCBGA1023 | PPGA478, PBGA479 |
Thermal Design Power (TDP) | 17 Watt | 34 Watt |
Scenario Design Power (SDP) | 0 W | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |