Intel Core i3-2375M vs Intel Core 2 Duo T7200
Comparative analysis of Intel Core i3-2375M and Intel Core 2 Duo T7200 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-2375M
- CPU is newer: launch date 6 year(s) 6 month(s) later
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x lower typical power consumption: 17 Watt vs 34 Watt
- Around 22% better performance in PassMark - CPU mark: 903 vs 738
- Around 2% better performance in Geekbench 4 - Single Core: 254 vs 250
- Around 37% better performance in Geekbench 4 - Multi-Core: 579 vs 422
| Specifications (specs) | |
| Launch date | 3 February 2013 vs 28 July 2006 |
| Number of threads | 4 vs 2 |
| Manufacturing process technology | 32 nm vs 65 nm |
| L1 cache | 128 KB vs 64 KB |
| Thermal Design Power (TDP) | 17 Watt vs 34 Watt |
| Benchmarks | |
| PassMark - CPU mark | 903 vs 738 |
| Geekbench 4 - Single Core | 254 vs 250 |
| Geekbench 4 - Multi-Core | 579 vs 422 |
Reasons to consider the Intel Core 2 Duo T7200
- Around 33% higher clock speed: 2 GHz vs 1.5 GHz
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 7% better performance in PassMark - Single thread mark: 743 vs 693
| Specifications (specs) | |
| Maximum frequency | 2 GHz vs 1.5 GHz |
| L2 cache | 4096 KB vs 512 KB |
| Benchmarks | |
| PassMark - Single thread mark | 743 vs 693 |
Compare benchmarks
CPU 1: Intel Core i3-2375M
CPU 2: Intel Core 2 Duo T7200
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Core i3-2375M | Intel Core 2 Duo T7200 |
|---|---|---|
| PassMark - Single thread mark | 693 | 743 |
| PassMark - CPU mark | 903 | 738 |
| Geekbench 4 - Single Core | 254 | 250 |
| Geekbench 4 - Multi-Core | 579 | 422 |
Compare specifications (specs)
| Intel Core i3-2375M | Intel Core 2 Duo T7200 | |
|---|---|---|
Essentials |
||
| Architecture codename | Sandy Bridge | Merom |
| Launch date | 3 February 2013 | 28 July 2006 |
| Launch price (MSRP) | $250 | $286 |
| Place in performance rating | 2977 | 2971 |
| Processor Number | i3-2375M | T7200 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Vertical segment | Mobile | Mobile |
| Price now | $99.95 | |
| Value for money (0-100) | 3.44 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.50 GHz | 2.00 GHz |
| Bus Speed | 5 GT/s DMI | 667 MHz FSB |
| Die size | 149 mm | 143 mm2 |
| L1 cache | 128 KB | 64 KB |
| L2 cache | 512 KB | 4096 KB |
| L3 cache | 3072 KB | |
| Manufacturing process technology | 32 nm | 65 nm |
| Maximum core temperature | 100 °C | 100°C |
| Maximum frequency | 1.5 GHz | 2 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 2 |
| Transistor count | 624 Million | 291 million |
| Front-side bus (FSB) | 667 MHz | |
| VID voltage range | 1.0375V-1.300V | |
Memory |
||
| Max memory channels | 2 | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3 1066/1333 | |
Graphics |
||
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.00 GHz | |
| Graphics max frequency | 1 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
Graphics interfaces |
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| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 31.0mm x 24.0mm (BGA1023) | 35mm x 35mm |
| Sockets supported | FCBGA1023 | PPGA478, PBGA479 |
| Thermal Design Power (TDP) | 17 Watt | 34 Watt |
| Scenario Design Power (SDP) | 0 W | |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| FSB parity | ||
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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