Intel Core i3-3210 vs AMD Phenom II X3 B73
Comparative analysis of Intel Core i3-3210 and AMD Phenom II X3 B73 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s).
Differences
Reasons to consider the Intel Core i3-3210
- CPU is newer: launch date 3 year(s) 3 month(s) later
- Around 14% higher clock speed: 3.2 GHz vs 2.8 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 73% lower typical power consumption: 55 Watt vs 95 Watt
- Around 61% better performance in PassMark - Single thread mark: 1704 vs 1056
- Around 45% better performance in PassMark - CPU mark: 2233 vs 1538
Specifications (specs) | |
Launch date | January 2013 vs October 2009 |
Maximum frequency | 3.2 GHz vs 2.8 GHz |
Manufacturing process technology | 22 nm vs 45 nm |
Thermal Design Power (TDP) | 55 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 1704 vs 1056 |
PassMark - CPU mark | 2233 vs 1538 |
Reasons to consider the AMD Phenom II X3 B73
- 1 more cores, run more applications at once: 3 vs 2
- 3x more L1 cache, more data can be stored in the L1 cache for quick access later
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
Number of cores | 3 vs 2 |
L1 cache | 128 KB (per core) vs 64 KB (per core) |
L2 cache | 512 KB (per core) vs 256 KB (per core) |
L3 cache | 6144 KB (shared) vs 3072 KB (shared) |
Compare benchmarks
CPU 1: Intel Core i3-3210
CPU 2: AMD Phenom II X3 B73
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-3210 | AMD Phenom II X3 B73 |
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PassMark - Single thread mark | 1704 | 1056 |
PassMark - CPU mark | 2233 | 1538 |
Geekbench 4 - Single Core | 543 | |
Geekbench 4 - Multi-Core | 1244 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 6.351 |
Compare specifications (specs)
Intel Core i3-3210 | AMD Phenom II X3 B73 | |
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Essentials |
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Architecture codename | Ivy Bridge | Heka |
Launch date | January 2013 | October 2009 |
Launch price (MSRP) | $120 | $75 |
Place in performance rating | 2220 | 2223 |
Price now | $138 | $75 |
Processor Number | i3-3210 | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Value for money (0-100) | 8.60 | 10.75 |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.20 GHz | |
Bus Speed | 5 GT/s DMI | |
Die size | 94 mm | 258 mm |
L1 cache | 64 KB (per core) | 128 KB (per core) |
L2 cache | 256 KB (per core) | 512 KB (per core) |
L3 cache | 3072 KB (shared) | 6144 KB (shared) |
Manufacturing process technology | 22 nm | 45 nm |
Maximum case temperature (TCase) | 65 °C | |
Maximum core temperature | 65.3°C | |
Maximum frequency | 3.2 GHz | 2.8 GHz |
Number of cores | 2 | 3 |
Number of threads | 4 | |
Transistor count | 758 million | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1333/1600 | DDR3 |
Graphics |
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Device ID | 0x152 | |
Graphics base frequency | 650 MHz | |
Graphics max dynamic frequency | 1.05 GHz | |
Graphics max frequency | 1.05 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 2500 | |
Graphics interfaces |
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Number of displays supported | 3 | |
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1155 | AM3 |
Thermal Design Power (TDP) | 55 Watt | 95 Watt |
Thermal Solution | 2011C | |
Peripherals |
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PCI Express revision | 2.0 | |
PCIe configurations | up to 1x16, 2x8, 1x8 & 2x4 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |