Intel Core i3-330E vs Intel Celeron 2980U

Comparative analysis of Intel Core i3-330E and Intel Celeron 2980U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Core i3-330E

  • 2 more threads: 4 vs 2
  • Around 15% better performance in PassMark - CPU mark: 1260 vs 1092
Specifications (specs)
Number of threads 4 vs 2
Benchmarks
PassMark - Single thread mark 934 vs 933
PassMark - CPU mark 1260 vs 1092

Reasons to consider the Intel Celeron 2980U

  • Around 11% higher maximum core temperature: 100°C vs 90°C for rPGA,105°C for BGA
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
  • Around 82% higher maximum memory size: 16 GB vs 8.79 GB
  • 2.3x lower typical power consumption: 15 Watt vs 35 Watt
Maximum core temperature 100°C vs 90°C for rPGA,105°C for BGA
Manufacturing process technology 22 nm vs 32 nm
Maximum memory size 16 GB vs 8.79 GB
Thermal Design Power (TDP) 15 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Core i3-330E
CPU 2: Intel Celeron 2980U

PassMark - Single thread mark
CPU 1
CPU 2
934
933
PassMark - CPU mark
CPU 1
CPU 2
1260
1092
Name Intel Core i3-330E Intel Celeron 2980U
PassMark - Single thread mark 934 933
PassMark - CPU mark 1260 1092

Compare specifications (specs)

Intel Core i3-330E Intel Celeron 2980U

Essentials

Architecture codename Arrandale Haswell
Launch date Q1'10 1 October 2013
Place in performance rating 2359 2364
Processor Number i3-330E 2980U
Series Legacy Intel® Core™ Processors Intel® Celeron® Processor 2000 Series
Status Launched Launched
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 2.13 GHz 1.60 GHz
Bus Speed 2.5 GT/s DMI 5 GT/s DMI2
Die size 81 mm2 118 mm
Manufacturing process technology 32 nm 22 nm
Maximum core temperature 90°C for rPGA,105°C for BGA 100°C
Number of cores 2 2
Number of threads 4 2
Transistor count 382 million 1400 million
L1 cache 128 KB
L2 cache 512 KB
L3 cache 2 MB
Maximum case temperature (TCase) 72 °C
Maximum frequency 1.6 GHz

Memory

Max memory channels 2 2
Maximum memory bandwidth 17.1 GB/s 25.6 GB/s
Maximum memory size 8.79 GB 16 GB
Supported memory types DDR3 800/1066 DDR3L 1333/1600, LPDDR3 1333/1600

Graphics

Graphics base frequency 500 MHz 200 MHz
Graphics max dynamic frequency 667 MHz 1.00 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics Intel HD Graphics Intel HD Graphics
Graphics max frequency 1 GHz
Intel® Quick Sync Video

Graphics interfaces

Number of displays supported 2 3
DisplayPort
eDP
HDMI
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size BGA 34mmX28mm 40mm x 24mm x 1.5mm
Sockets supported BGA1288 FCBGA1168
Thermal Design Power (TDP) 35 Watt 15 Watt

Peripherals

Max number of PCIe lanes 16 12
PCI Express revision 2.0 2.0
PCIe configurations 1X16, 2X8 4x1, 2x4
Integrated IDE
Integrated LAN
Max number of SATA 6 Gb/s Ports 2
Number of USB ports 4
PCI support
Total number of SATA ports 4
UART
USB revision 3.0

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2 Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 36-bit
Thermal Monitoring
Flexible Display interface (FDI)
General-Purpose Input/Output (GPIO)
HD Audio
Intel® Active Management technology (AMT)
Intel® ME Firmware Version 9.5
Intel® Rapid Storage technology (RST)
Intel® Smart Response technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Matrix Storage
Smart Connect

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)