Intel Core i3-330E vs Intel Celeron 867
Comparative analysis of Intel Core i3-330E and Intel Celeron 867 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-330E
- 2 more threads: 4 vs 2
- Around 60% better performance in PassMark - Single thread mark: 934 vs 584
- 2.2x better performance in PassMark - CPU mark: 1260 vs 562
Specifications (specs) | |
Number of threads | 4 vs 2 |
Benchmarks | |
PassMark - Single thread mark | 934 vs 584 |
PassMark - CPU mark | 1260 vs 562 |
Reasons to consider the Intel Celeron 867
- Around 11% higher maximum core temperature: 100 °C vs 90°C for rPGA,105°C for BGA
- Around 82% higher maximum memory size: 16 GB vs 8.79 GB
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
Maximum core temperature | 100 °C vs 90°C for rPGA,105°C for BGA |
Maximum memory size | 16 GB vs 8.79 GB |
Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Core i3-330E
CPU 2: Intel Celeron 867
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i3-330E | Intel Celeron 867 |
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PassMark - Single thread mark | 934 | 584 |
PassMark - CPU mark | 1260 | 562 |
Geekbench 4 - Single Core | 1227 | |
Geekbench 4 - Multi-Core | 1800 |
Compare specifications (specs)
Intel Core i3-330E | Intel Celeron 867 | |
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Essentials |
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Architecture codename | Arrandale | Sandy Bridge |
Launch date | Q1'10 | 1 December 2011 |
Place in performance rating | 2354 | 2350 |
Processor Number | i3-330E | 867 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Celeron® Processor |
Status | Launched | Launched |
Vertical segment | Mobile | Mobile |
Price now | $29.99 | |
Value for money (0-100) | 11.51 | |
Performance |
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64 bit support | ||
Base frequency | 2.13 GHz | 1.30 GHz |
Bus Speed | 2.5 GT/s DMI | 5 GT/s DMI |
Die size | 81 mm2 | 131 mm |
Manufacturing process technology | 32 nm | 32 nm |
Maximum core temperature | 90°C for rPGA,105°C for BGA | 100 °C |
Number of cores | 2 | 2 |
Number of threads | 4 | 2 |
Transistor count | 382 million | 504 million |
L1 cache | 128 KB | |
L2 cache | 512 KB | |
L3 cache | 2048 KB | |
Maximum frequency | 1.3 GHz | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 17.1 GB/s | 21.3 GB/s |
Maximum memory size | 8.79 GB | 16 GB |
Supported memory types | DDR3 800/1066 | DDR3 1066/1333 |
Graphics |
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Graphics base frequency | 500 MHz | 350 MHz |
Graphics max dynamic frequency | 667 MHz | 1.00 GHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics | Intel HD Graphics |
Graphics max frequency | 1 GHz | |
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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Number of displays supported | 2 | 2 |
CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | BGA 34mmX28mm | 31.0mm x 24.0mm (BGA1023) |
Sockets supported | BGA1288 | BGA1023 |
Thermal Design Power (TDP) | 35 Watt | 17 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 2.0 | 2.0 |
PCIe configurations | 1X16, 2X8 | 1x16, 2x8, 1x8 2x4 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Anti-Theft technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
4G WiMAX Wireless | ||
Flexible Display interface (FDI) | ||
Intel® Demand Based Switching | ||
Intel® My WiFi technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |