Intel Core i3-550 vs Intel Core 2 Duo E6400
Comparative analysis of Intel Core i3-550 and Intel Core 2 Duo E6400 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-550
- CPU is newer: launch date 3 year(s) 10 month(s) later
- Around 50% higher clock speed: 3.2 GHz vs 2.13 GHz
- Around 18% higher maximum core temperature: 72.6°C vs 61.4°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 62% better performance in PassMark - Single thread mark: 1340 vs 825
- 2.1x better performance in PassMark - CPU mark: 1609 vs 780
- Around 96% better performance in Geekbench 4 - Single Core: 478 vs 244
- 2.6x better performance in Geekbench 4 - Multi-Core: 1061 vs 413
| Specifications (specs) | |
| Launch date | May 2010 vs July 2006 |
| Maximum frequency | 3.2 GHz vs 2.13 GHz |
| Maximum core temperature | 72.6°C vs 61.4°C |
| Manufacturing process technology | 32 nm vs 65 nm |
| L1 cache | 64 KB (per core) vs 64 KB |
| Benchmarks | |
| PassMark - Single thread mark | 1340 vs 825 |
| PassMark - CPU mark | 1609 vs 780 |
| Geekbench 4 - Single Core | 478 vs 244 |
| Geekbench 4 - Multi-Core | 1061 vs 413 |
Reasons to consider the Intel Core 2 Duo E6400
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 12% lower typical power consumption: 65 Watt vs 73 Watt
| L2 cache | 2048 KB vs 256 KB (per core) |
| Thermal Design Power (TDP) | 65 Watt vs 73 Watt |
Compare benchmarks
CPU 1: Intel Core i3-550
CPU 2: Intel Core 2 Duo E6400
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Core i3-550 | Intel Core 2 Duo E6400 |
|---|---|---|
| PassMark - Single thread mark | 1340 | 825 |
| PassMark - CPU mark | 1609 | 780 |
| Geekbench 4 - Single Core | 478 | 244 |
| Geekbench 4 - Multi-Core | 1061 | 413 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.529 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 31.203 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.156 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.842 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.358 |
Compare specifications (specs)
| Intel Core i3-550 | Intel Core 2 Duo E6400 | |
|---|---|---|
Essentials |
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| Architecture codename | Clarkdale | Conroe |
| Launch date | May 2010 | July 2006 |
| Launch price (MSRP) | $101 | |
| Place in performance rating | 2923 | 2913 |
| Price now | $179.95 | $19.95 |
| Processor Number | i3-550 | E6400 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Discontinued | Discontinued |
| Value for money (0-100) | 4.63 | 19.03 |
| Vertical segment | Desktop | Desktop |
Performance |
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| 64 bit support | ||
| Base frequency | 3.20 GHz | 2.13 GHz |
| Bus Speed | 2.5 GT/s DMI | 1066 MHz FSB |
| Die size | 81 mm2 | 111 mm2 |
| L1 cache | 64 KB (per core) | 64 KB |
| L2 cache | 256 KB (per core) | 2048 KB |
| L3 cache | 4096 KB (shared) | |
| Manufacturing process technology | 32 nm | 65 nm |
| Maximum core temperature | 72.6°C | 61.4°C |
| Maximum frequency | 3.2 GHz | 2.13 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | |
| Transistor count | 382 million | 167 million |
| VID voltage range | 0.6500V-1.4000V | 0.8500V-1.5V |
Memory |
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| Max memory channels | 2 | |
| Maximum memory bandwidth | 21 GB/s | |
| Maximum memory size | 16.38 GB | |
| Supported memory types | DDR3 1066/1333 | DDR1, DDR2, DDR3 |
Graphics |
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| Graphics base frequency | 733 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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| Number of displays supported | 2 | |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| Sockets supported | FCLGA1156 | PLGA775, LGA775 |
| Thermal Design Power (TDP) | 73 Watt | 65 Watt |
| Scenario Design Power (SDP) | 0 W | |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
| Thermal Monitoring | ||
| FSB parity | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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