Intel Core i3-6100E vs AMD E2-9000
Comparative analysis of Intel Core i3-6100E and AMD E2-9000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-6100E
- 2 more threads: 4 vs 2
- Around 11% higher maximum core temperature: 100°C vs 90 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 28 nm
- 2.1x better performance in PassMark - Single thread mark: 1688 vs 816
- 3.4x better performance in PassMark - CPU mark: 3315 vs 967
| Specifications (specs) | |
| Number of threads | 4 vs 2 |
| Maximum core temperature | 100°C vs 90 °C |
| Manufacturing process technology | 14 nm vs 28 nm |
| Benchmarks | |
| PassMark - Single thread mark | 1688 vs 816 |
| PassMark - CPU mark | 3315 vs 967 |
Reasons to consider the AMD E2-9000
- 3.5x lower typical power consumption: 10 Watt vs 35 Watt
| Thermal Design Power (TDP) | 10 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Core i3-6100E
CPU 2: AMD E2-9000
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i3-6100E | AMD E2-9000 |
|---|---|---|
| PassMark - Single thread mark | 1688 | 816 |
| PassMark - CPU mark | 3315 | 967 |
| Geekbench 4 - Single Core | 3121 | |
| Geekbench 4 - Multi-Core | 5917 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.803 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 38.873 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.216 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.019 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.269 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 514 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 514 | |
| GFXBench 4.0 - Manhattan (Frames) | 1227 | |
| GFXBench 4.0 - Manhattan (Fps) | 1227 | |
| GFXBench 4.0 - T-Rex (Frames) | 3313 | |
| GFXBench 4.0 - T-Rex (Fps) | 3313 |
Compare specifications (specs)
| Intel Core i3-6100E | AMD E2-9000 | |
|---|---|---|
Essentials |
||
| Architecture codename | Skylake | Stoney Ridge |
| Launch date | Q4'15 | 1 June 2016 |
| Place in performance rating | 1915 | 1900 |
| Processor Number | i3-6100E | |
| Series | 6th Generation Intel® Core™ i3 Processors | Bristol Ridge |
| Status | Launched | |
| Vertical segment | Embedded | Laptop |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.70 GHz | |
| Bus Speed | 8 GT/s DMI3 | |
| Manufacturing process technology | 14 nm | 28 nm |
| Maximum core temperature | 100°C | 90 °C |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 2 |
| Die size | 124.5 mm | |
| Maximum frequency | 2.2 GHz | |
| Transistor count | 1200 Million | |
Memory |
||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 34.1 GB/s | |
| Maximum memory size | 64 GB | |
| Supported memory types | DDR4-2133, LPDDR3-1866, DDR3L-1600 | |
Graphics |
||
| Device ID | 0x191B | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 950 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel® HD Graphics 530 | |
Graphics interfaces |
||
| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
||
| DirectX | 12 | |
| OpenGL | 4.5 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 42mm x 28mm | |
| Sockets supported | FCBGA1440 | |
| Thermal Design Power (TDP) | 35 Watt | 10 Watt |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||
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