Intel Core i3-9100TE vs Intel Core i7-4770TE
Comparative analysis of Intel Core i3-9100TE and Intel Core i7-4770TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i3-9100TE
- Around 40% higher maximum core temperature: 100°C vs 71.45°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 2x more maximum memory size: 64 GB vs 32 GB
- Around 29% lower typical power consumption: 35 Watt vs 45 Watt
| Specifications (specs) | |
| Maximum core temperature | 100°C vs 71.45°C |
| Manufacturing process technology | 14 nm vs 22 nm |
| Maximum memory size | 64 GB vs 32 GB |
| Thermal Design Power (TDP) | 35 Watt vs 45 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1690 vs 1688 |
Reasons to consider the Intel Core i7-4770TE
- 4 more threads: 8 vs 4
- Around 3% higher clock speed: 3.30 GHz vs 3.20 GHz
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 14% better performance in PassMark - CPU mark: 4983 vs 4382
| Specifications (specs) | |
| Number of threads | 8 vs 4 |
| Maximum frequency | 3.30 GHz vs 3.20 GHz |
| L3 cache | 8192 KB (shared) vs 6 MB |
| Benchmarks | |
| PassMark - CPU mark | 4983 vs 4382 |
Compare benchmarks
CPU 1: Intel Core i3-9100TE
CPU 2: Intel Core i7-4770TE
| PassMark - Single thread mark |
|
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| PassMark - CPU mark |
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| Name | Intel Core i3-9100TE | Intel Core i7-4770TE |
|---|---|---|
| PassMark - Single thread mark | 1690 | 1688 |
| PassMark - CPU mark | 4382 | 4983 |
Compare specifications (specs)
| Intel Core i3-9100TE | Intel Core i7-4770TE | |
|---|---|---|
Essentials |
||
| Architecture codename | Coffee Lake | Haswell |
| Launch date | Q2'19 | June 2013 |
| Launch price (MSRP) | $122 | |
| Place in performance rating | 1507 | 1497 |
| Processor Number | i3-9100TE | i7-4770TE |
| Series | 9th Generation Intel Core i3 Processors | 4th Generation Intel® Core™ i7 Processors |
| Status | Launched | Launched |
| Vertical segment | Embedded | Embedded |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.20 GHz | 2.30 GHz |
| Bus Speed | 8 GT/s | 5 GT/s DMI |
| L1 cache | 256 KB | 64 KB (per core) |
| L2 cache | 1 MB | 256 KB (per core) |
| L3 cache | 6 MB | 8192 KB (shared) |
| Manufacturing process technology | 14 nm | 22 nm |
| Maximum core temperature | 100°C | 71.45°C |
| Maximum frequency | 3.20 GHz | 3.30 GHz |
| Number of cores | 4 | 4 |
| Number of threads | 4 | 8 |
| Die size | 177 mm | |
| Maximum case temperature (TCase) | 71 °C | |
| Transistor count | 1400 million | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 37.5 GB/s | 25.6 GB/s |
| Maximum memory size | 64 GB | 32 GB |
| Supported memory types | DDR-2400 | DDR3 1333/1600 |
Graphics |
||
| Device ID | 0x3E98 | |
| Graphics base frequency | 350 MHz | 350 MHz |
| Graphics max dynamic frequency | 1.05 GHz | 1.00 GHz |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | 2 GB |
| Processor graphics | Intel UHD Graphics 630 | Intel® HD Graphics 4600 |
| Graphics max frequency | 1 GHz | |
| Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
||
| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | 3 |
| VGA | ||
| Wireless Display (WiDi) support | ||
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096 x 2304@60Hz | |
| Max resolution over eDP | 4096 x 2304@60Hz | |
| Max resolution over HDMI 1.4 | N / A | |
Graphics API support |
||
| DirectX | 12 | 11.2/12 |
| OpenGL | 4.5 | 4.3 |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm (LGA1150) |
| Sockets supported | FCLGA1151 | FCLGA1150 |
| Thermal Design Power (TDP) | 35 Watt | 45 Watt |
| Low Halogen Options Available | ||
| Thermal Solution | PCG 2013B | |
Peripherals |
||
| Max number of PCIe lanes | 16 | 16 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x16 |
| Scalability | 1S Only | 1S Only |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
| Anti-Theft technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| Flexible Display interface (FDI) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® TSX-NI | ||
| Intel® vPro™ Platform Eligibility | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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