Architecture codename |
Lakefield |
Skylake |
Launch date |
Q2'20 |
1 September 2015 |
Launch price (MSRP) |
$281 |
|
Place in performance rating |
1578 |
1587 |
Processor Number |
i5-L16G7 |
i3-6167U |
Series |
Intel Core Processors with Intel Hybrid Technology |
6th Generation Intel® Core™ i3 Processors |
Status |
Launched |
Launched |
Vertical segment |
Mobile |
Mobile |
64 bit support |
|
|
Base frequency |
1.40 GHz |
2.70 GHz |
Bus Speed |
4 GT/s |
4 GT/s OPI |
L3 cache |
4 MB |
3 MB |
Manufacturing process technology |
10 nm |
14 nm |
Maximum core temperature |
100°C |
100°C |
Maximum frequency |
3.00 GHz |
2.7 GHz |
Number of cores |
5 |
2 |
Number of threads |
5 |
4 |
L1 cache |
|
128 KB |
L2 cache |
|
512 KB |
Maximum memory bandwidth |
34 GB/s |
34.1 GB/s |
Maximum memory size |
8 GB |
32 GB |
Supported memory frequency |
4267 MHz |
|
Supported memory types |
LPDDR4X 4267 POP Memory |
DDR4-2133, LPDDR3-1866, DDR3L-1600 |
Max memory channels |
|
2 |
Device ID |
9940 |
0x1927 |
Execution Units |
64 |
|
Graphics base frequency |
200 MHz |
300 MHz |
Graphics max dynamic frequency |
500 MHz |
1.00 GHz |
Intel® Quick Sync Video |
|
|
Processor graphics |
Intel UHD Graphics |
Intel® Iris® Graphics 550 |
eDRAM |
|
64 MB |
Graphics max frequency |
|
1 GHz |
Intel® Clear Video HD technology |
|
|
Intel® Clear Video technology |
|
|
Intel® InTru™ 3D technology |
|
|
Max video memory |
|
32 GB |
Number of displays supported |
4 |
3 |
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Wireless Display (WiDi) support |
|
|
4K resolution support |
|
|
Max resolution over DisplayPort |
|
4096x2304@60Hz |
Max resolution over eDP |
|
4096x2304@60Hz |
Max resolution over HDMI 1.4 |
|
4096x2304@24Hz |
Max resolution over VGA |
|
N / A |
Max resolution over WiDi |
|
1080p |
DirectX |
DX12 |
12 |
OpenGL |
OpenGL4.5 |
4.5 |
Max number of CPUs in a configuration |
1 |
1 |
Package Size |
12mm x 12mm |
42mm X 24mm |
Scenario Design Power (SDP) |
7 W |
|
Sockets supported |
FC-CSP1016 |
FCBGA1356 |
Configurable TDP-down |
|
23 W |
Low Halogen Options Available |
|
|
Thermal Design Power (TDP) |
|
28 Watt |
Max number of PCIe lanes |
6 |
12 |
PCI Express revision |
3.0 |
3.0 |
PCIe configurations |
1x2, 1x2 + 2x1 |
1x4, 2x2, 1x2+2x1 and 4x1 |
Anti-Theft technology |
|
|
Execute Disable Bit (EDB) |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Intel® Secure Key technology |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Intel® Trusted Execution technology (TXT) |
|
|
Secure Boot |
|
|
Intel® Identity Protection technology |
|
|
Idle States |
|
|
Instruction set extensions |
Intel SSE4.1, Intel SSE4.2 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Hyper-Threading technology |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® Turbo Boost technology |
|
|
Speed Shift technology |
|
|
Enhanced Intel SpeedStep® technology |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® My WiFi technology |
|
|
Intel® Smart Response technology |
|
|
Intel® TSX-NI |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
AMD Virtualization (AMD-V™) |
|
|