Intel Core i5-L16G7 vs Intel Core i3-6167U
Comparative analysis of Intel Core i5-L16G7 and Intel Core i3-6167U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps).
Differences
Reasons to consider the Intel Core i5-L16G7
- 3 more cores, run more applications at once: 5 vs 2
- 1 more threads: 5 vs 4
- Around 11% higher clock speed: 3.00 GHz vs 2.7 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
| Number of cores | 5 vs 2 |
| Number of threads | 5 vs 4 |
| Maximum frequency | 3.00 GHz vs 2.7 GHz |
| Manufacturing process technology | 10 nm vs 14 nm |
| L3 cache | 4 MB vs 3 MB |
Reasons to consider the Intel Core i3-6167U
- 4x more maximum memory size: 32 GB vs 8 GB
| Maximum memory size | 32 GB vs 8 GB |
Compare benchmarks
CPU 1: Intel Core i5-L16G7
CPU 2: Intel Core i3-6167U
| Name | Intel Core i5-L16G7 | Intel Core i3-6167U |
|---|---|---|
| PassMark - Single thread mark | 1612 | |
| PassMark - CPU mark | 3386 | |
| GFXBench 4.0 - Manhattan (Frames) | 1252 | |
| GFXBench 4.0 - Manhattan (Fps) | 1252 |
Compare specifications (specs)
| Intel Core i5-L16G7 | Intel Core i3-6167U | |
|---|---|---|
Essentials |
||
| Architecture codename | Lakefield | Skylake |
| Launch date | Q2'20 | 1 September 2015 |
| Launch price (MSRP) | $281 | |
| Place in performance rating | 1580 | 1588 |
| Processor Number | i5-L16G7 | i3-6167U |
| Series | Intel Core Processors with Intel Hybrid Technology | 6th Generation Intel® Core™ i3 Processors |
| Status | Launched | Launched |
| Vertical segment | Mobile | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.40 GHz | 2.70 GHz |
| Bus Speed | 4 GT/s | 4 GT/s OPI |
| L3 cache | 4 MB | 3 MB |
| Manufacturing process technology | 10 nm | 14 nm |
| Maximum core temperature | 100°C | 100°C |
| Maximum frequency | 3.00 GHz | 2.7 GHz |
| Number of cores | 5 | 2 |
| Number of threads | 5 | 4 |
| L1 cache | 128 KB | |
| L2 cache | 512 KB | |
Memory |
||
| Maximum memory bandwidth | 34 GB/s | 34.1 GB/s |
| Maximum memory size | 8 GB | 32 GB |
| Supported memory frequency | 4267 MHz | |
| Supported memory types | LPDDR4X 4267 POP Memory | DDR4-2133, LPDDR3-1866, DDR3L-1600 |
| Max memory channels | 2 | |
Graphics |
||
| Device ID | 9940 | 0x1927 |
| Execution Units | 64 | |
| Graphics base frequency | 200 MHz | 300 MHz |
| Graphics max dynamic frequency | 500 MHz | 1.00 GHz |
| Intel® Quick Sync Video | ||
| Processor graphics | Intel UHD Graphics | Intel® Iris® Graphics 550 |
| eDRAM | 64 MB | |
| Graphics max frequency | 1 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Max video memory | 32 GB | |
Graphics interfaces |
||
| Number of displays supported | 4 | 3 |
| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Wireless Display (WiDi) support | ||
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
| Max resolution over VGA | N / A | |
| Max resolution over WiDi | 1080p | |
Graphics API support |
||
| DirectX | DX12 | 12 |
| OpenGL | OpenGL4.5 | 4.5 |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 12mm x 12mm | 42mm X 24mm |
| Scenario Design Power (SDP) | 7 W | |
| Sockets supported | FC-CSP1016 | FCBGA1356 |
| Configurable TDP-down | 23 W | |
| Low Halogen Options Available | ||
| Thermal Design Power (TDP) | 28 Watt | |
Peripherals |
||
| Max number of PCIe lanes | 6 | 12 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | 1x2, 1x2 + 2x1 | 1x4, 2x2, 1x2+2x1 and 4x1 |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
| Intel® Identity Protection technology | ||
Advanced Technologies |
||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® Turbo Boost technology | ||
| Speed Shift technology | ||
| Enhanced Intel SpeedStep® technology | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® My WiFi technology | ||
| Intel® Smart Response technology | ||
| Intel® TSX-NI | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||
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