Intel Core i7-870 vs AMD Phenom X3 8250e
Comparative analysis of Intel Core i7-870 and AMD Phenom X3 8250e processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i7-870
- CPU is newer: launch date 1 year(s) 0 month(s) later
- 1 more cores, run more applications at once: 4 vs 3
- Around 89% higher clock speed: 3.60 GHz vs 1.9 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 4x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 90% better performance in PassMark - Single thread mark: 1384 vs 729
- 2.9x better performance in PassMark - CPU mark: 3137 vs 1084
Specifications (specs) | |
Launch date | September 2009 vs September 2008 |
Number of cores | 4 vs 3 |
Maximum frequency | 3.60 GHz vs 1.9 GHz |
Manufacturing process technology | 45 nm vs 65 nm |
L3 cache | 8192 KB (shared) vs 2048 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 1384 vs 729 |
PassMark - CPU mark | 3137 vs 1084 |
Reasons to consider the AMD Phenom X3 8250e
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 46% lower typical power consumption: 65 Watt vs 95 Watt
L1 cache | 128 KB (per core) vs 64 KB (per core) |
L2 cache | 512 KB (per core) vs 256 KB (per core) |
Thermal Design Power (TDP) | 65 Watt vs 95 Watt |
Compare benchmarks
CPU 1: Intel Core i7-870
CPU 2: AMD Phenom X3 8250e
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i7-870 | AMD Phenom X3 8250e |
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PassMark - Single thread mark | 1384 | 729 |
PassMark - CPU mark | 3137 | 1084 |
Geekbench 4 - Single Core | 547 | |
Geekbench 4 - Multi-Core | 2032 | |
3DMark Fire Strike - Physics Score | 2453 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.029 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 53.478 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.342 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.541 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 4.602 |
Compare specifications (specs)
Intel Core i7-870 | AMD Phenom X3 8250e | |
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Essentials |
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Architecture codename | Lynnfield | Toliman |
Launch date | September 2009 | September 2008 |
Launch price (MSRP) | $197 | |
Place in performance rating | 2671 | 2651 |
Price now | $98.99 | |
Processor Number | i7-870 | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Value for money (0-100) | 15.90 | |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 2.93 GHz | |
Bus Speed | 2.5 GT/s DMI | |
Die size | 296 mm2 | 285 mm |
L1 cache | 64 KB (per core) | 128 KB (per core) |
L2 cache | 256 KB (per core) | 512 KB (per core) |
L3 cache | 8192 KB (shared) | 2048 KB (shared) |
Manufacturing process technology | 45 nm | 65 nm |
Maximum core temperature | 72.7°C | |
Maximum frequency | 3.60 GHz | 1.9 GHz |
Number of cores | 4 | 3 |
Number of threads | 8 | |
Transistor count | 774 million | 450 million |
VID voltage range | 0.6500V-1.4000V | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21 GB/s | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3 1066/1333 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | LGA1156 | AM2+ |
Thermal Design Power (TDP) | 95 Watt | 65 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |