Intel Core i7-870 vs AMD Phenom X3 8250e
Comparative analysis of Intel Core i7-870 and AMD Phenom X3 8250e processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i7-870
- CPU is newer: launch date 1 year(s) 0 month(s) later
- 1 more cores, run more applications at once: 4 vs 3
- Around 89% higher clock speed: 3.60 GHz vs 1.9 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 4x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 90% better performance in PassMark - Single thread mark: 1385 vs 729
- 2.9x better performance in PassMark - CPU mark: 3160 vs 1084
| Specifications (specs) | |
| Launch date | September 2009 vs September 2008 |
| Number of cores | 4 vs 3 |
| Maximum frequency | 3.60 GHz vs 1.9 GHz |
| Manufacturing process technology | 45 nm vs 65 nm |
| L3 cache | 8192 KB (shared) vs 2048 KB (shared) |
| Benchmarks | |
| PassMark - Single thread mark | 1385 vs 729 |
| PassMark - CPU mark | 3160 vs 1084 |
Reasons to consider the AMD Phenom X3 8250e
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 46% lower typical power consumption: 65 Watt vs 95 Watt
| L1 cache | 128 KB (per core) vs 64 KB (per core) |
| L2 cache | 512 KB (per core) vs 256 KB (per core) |
| Thermal Design Power (TDP) | 65 Watt vs 95 Watt |
Compare benchmarks
CPU 1: Intel Core i7-870
CPU 2: AMD Phenom X3 8250e
| PassMark - Single thread mark |
|
|
||||
| PassMark - CPU mark |
|
|
| Name | Intel Core i7-870 | AMD Phenom X3 8250e |
|---|---|---|
| PassMark - Single thread mark | 1385 | 729 |
| PassMark - CPU mark | 3160 | 1084 |
| Geekbench 4 - Single Core | 547 | |
| Geekbench 4 - Multi-Core | 2032 | |
| 3DMark Fire Strike - Physics Score | 2453 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.029 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 53.478 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.342 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.541 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 4.602 |
Compare specifications (specs)
| Intel Core i7-870 | AMD Phenom X3 8250e | |
|---|---|---|
Essentials |
||
| Architecture codename | Lynnfield | Toliman |
| Launch date | September 2009 | September 2008 |
| Launch price (MSRP) | $197 | |
| Place in performance rating | 2680 | 2662 |
| Price now | $98.99 | |
| Processor Number | i7-870 | |
| Series | Legacy Intel® Core™ Processors | |
| Status | Discontinued | |
| Value for money (0-100) | 15.90 | |
| Vertical segment | Desktop | Desktop |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.93 GHz | |
| Bus Speed | 2.5 GT/s DMI | |
| Die size | 296 mm2 | 285 mm |
| L1 cache | 64 KB (per core) | 128 KB (per core) |
| L2 cache | 256 KB (per core) | 512 KB (per core) |
| L3 cache | 8192 KB (shared) | 2048 KB (shared) |
| Manufacturing process technology | 45 nm | 65 nm |
| Maximum core temperature | 72.7°C | |
| Maximum frequency | 3.60 GHz | 1.9 GHz |
| Number of cores | 4 | 3 |
| Number of threads | 8 | |
| Transistor count | 774 million | 450 million |
| VID voltage range | 0.6500V-1.4000V | |
Memory |
||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 21 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3 1066/1333 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | |
| Sockets supported | LGA1156 | AM2+ |
| Thermal Design Power (TDP) | 95 Watt | 65 Watt |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||