Intel Core i9-13900TE vs AMD Ryzen Embedded V2718
Comparative analysis of Intel Core i9-13900TE and AMD Ryzen Embedded V2718 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i9-13900TE
- CPU is newer: launch date 2 year(s) 1 month(s) later
- 16 more cores, run more applications at once: 24 vs 8
- 16 more threads: 32 vs 16
- Around 20% higher clock speed: 5.00 GHz vs 4.15 GHz
- 3.8x more L1 cache, more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 4.5x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2x more maximum memory size: 128 GB vs 64 GB
Launch date | 4 Jan 2023 vs 10 Nov 2020 |
Number of cores | 24 vs 8 |
Number of threads | 32 vs 16 |
Maximum frequency | 5.00 GHz vs 4.15 GHz |
L1 cache | 1920 KB vs 512 KB |
L2 cache | 32 MB vs 4 MB |
L3 cache | 36 MB vs 8 MB |
Maximum memory size | 128 GB vs 64 GB |
Reasons to consider the AMD Ryzen Embedded V2718
- Around 5% higher maximum core temperature: 105 °C vs 100°C
- 2.3x lower typical power consumption: 15 Watt vs 35 Watt
- Around 1% better performance in PassMark - Single thread mark: 2240 vs 2209
- Around 2% better performance in PassMark - CPU mark: 16075 vs 15819
Specifications (specs) | |
Maximum core temperature | 105 °C vs 100°C |
Thermal Design Power (TDP) | 15 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 2240 vs 2209 |
PassMark - CPU mark | 16075 vs 15819 |
Compare benchmarks
CPU 1: Intel Core i9-13900TE
CPU 2: AMD Ryzen Embedded V2718
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i9-13900TE | AMD Ryzen Embedded V2718 |
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PassMark - Single thread mark | 2209 | 2240 |
PassMark - CPU mark | 15819 | 16075 |
Compare specifications (specs)
Intel Core i9-13900TE | AMD Ryzen Embedded V2718 | |
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Essentials |
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Architecture codename | Raptor Lake | Zen 2 |
Launch date | 4 Jan 2023 | 10 Nov 2020 |
Place in performance rating | 983 | 970 |
Processor Number | i9-13900TE | |
Series | 13th Generation Intel Core i9 Processors | |
Vertical segment | Embedded | |
OPN Tray | 100-000000242 | |
Performance |
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64 bit support | ||
Base frequency | 1.00 GHz | 1.7 GHz |
L1 cache | 1920 KB | 512 KB |
L2 cache | 32 MB | 4 MB |
L3 cache | 36 MB | 8 MB |
Manufacturing process technology | 7 nm | 7 nm |
Maximum core temperature | 100°C | 105 °C |
Maximum frequency | 5.00 GHz | 4.15 GHz |
Number of cores | 24 | 8 |
Number of threads | 32 | 16 |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 89.6 GB/s | 63.58 GB/s |
Maximum memory size | 128 GB | 64 GB |
Supported memory types | Up to DDR5 5600 MT/s Up to DDR4 3200 MT/s | DDR4-3200, LPDDR4x-4266 |
ECC memory support | ||
Graphics |
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Device ID | 0xA780 | |
Execution Units | 32 | |
Graphics base frequency | 300 MHz | |
Graphics max dynamic frequency | 1.65 GHz | |
Intel® Clear Video HD technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel UHD Graphics 770 | Radeon Vega 7 |
Graphics max frequency | 1600 MHz | |
iGPU core count | 7 | |
Number of pipelines | 448 | |
Graphics interfaces |
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Number of displays supported | 4 | 4 |
DisplayPort | ||
HDMI | ||
Graphics image quality |
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Max resolution over DisplayPort | 7680 x 4320 @ 60Hz | 4096x2160 |
Max resolution over eDP | 5120 x 3200 @ 120Hz | |
Max resolution over HDMI 1.4 | 4096x2160 | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Package Size | 45.0 mm x 37.5 mm | |
Thermal Design Power (TDP) | 35 Watt | 15 Watt |
Thermal Solution | PCG 2020C | |
Configurable TDP | 10-25 Watt | |
Sockets supported | FP6 | |
Peripherals |
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Max number of PCIe lanes | 20 | 20 |
PCI Express revision | 5.0 and 4.0 | 3.0 |
PCIe configurations | Up to 1x16+4, 2x8+4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |