Intel Pentium 4 HT 641 vs Intel Pentium D 830

Comparative analysis of Intel Pentium 4 HT 641 and Intel Pentium D 830 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Pentium 4 HT 641

  • CPU is newer: launch date 8 month(s) later
  • Around 7% higher clock speed: 3.2 GHz vs 3 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
  • Around 51% lower typical power consumption: 86 Watt vs 130 Watt
Launch date January 2006 vs May 2005
Maximum frequency 3.2 GHz vs 3 GHz
Manufacturing process technology 65 nm vs 90 nm
Thermal Design Power (TDP) 86 Watt vs 130 Watt

Reasons to consider the Intel Pentium D 830

  • 1 more cores, run more applications at once: 2 vs 1
Number of cores 2 vs 1
Max number of CPUs in a configuration 2 vs 1

Compare benchmarks

CPU 1: Intel Pentium 4 HT 641
CPU 2: Intel Pentium D 830

Name Intel Pentium 4 HT 641 Intel Pentium D 830
PassMark - Single thread mark 574
PassMark - CPU mark 564
Geekbench 4 - Single Core 198
Geekbench 4 - Multi-Core 341

Compare specifications (specs)

Intel Pentium 4 HT 641 Intel Pentium D 830

Essentials

Architecture codename Cedarmill Smithfield
Launch date January 2006 May 2005
Place in performance rating not rated 3159
Processor Number 641 830
Series Legacy Intel® Pentium® Processor Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.20 GHz 3.00 GHz
Bus Speed 800 MHz FSB 800 MHz FSB
Die size 81 mm2 206 mm2
L1 cache 28 KB 28 KB
L2 cache 2048 KB 2048 KB
Manufacturing process technology 65 nm 90 nm
Maximum core temperature B1,C1=69.2°C; D0-64.4°C 69.8°C
Maximum frequency 3.2 GHz 3 GHz
Number of cores 1 2
Transistor count 188 million 230 million
VID voltage range 1.200V-1.3375V 1.200V-1.400V

Memory

Supported memory types DDR1, DDR2, DDR3 DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 2
Package Size 37.5mm x 37.5mm 37.5mm x 37.5mm
Scenario Design Power (SDP) 0 W
Sockets supported PLGA775 PLGA775
Thermal Design Power (TDP) 86 Watt 130 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit 32-bit
Thermal Monitoring
Intel® AES New Instructions

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)