Intel Pentium 977 vs Intel Atom Z670

Comparative analysis of Intel Pentium 977 and Intel Atom Z670 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Pentium 977

Intel Atom Z670

Differences

Reasons to consider the Intel Pentium 977

CPU is newer: launch date 1 year(s) 0 month(s) later
1 more cores, run more applications at once: 2 vs 1
Around 11% higher maximum core temperature: 100 °C vs 90
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
2x more L1 cache, more data can be stored in the L1 cache for quick access later
5.6x more maximum memory size: 16.38 GB vs 2.93 GB
7.3x better performance in PassMark - CPU mark: 1148 vs 158

Specifications (specs)
Launch date	1 April 2012 vs April 2011
Number of cores	2 vs 1
Maximum core temperature	100 °C vs 90
Manufacturing process technology	32 nm vs 45 nm
L1 cache	128 KB vs 64 KB (per core)
Maximum memory size	16.38 GB vs 2.93 GB
Benchmarks
PassMark - CPU mark	1148 vs 158

Reasons to consider the Intel Atom Z670

Around 7% higher clock speed: 1.5 GHz vs 1.4 GHz
5.7x lower typical power consumption: 3 Watt vs 17 Watt

Maximum frequency	1.5 GHz vs 1.4 GHz
Thermal Design Power (TDP)	3 Watt vs 17 Watt

Compare benchmarks

CPU 1: Intel Pentium 977
CPU 2: Intel Atom Z670

PassMark - CPU mark

CPU 1

CPU 2

1148

158

Name	Intel Pentium 977	Intel Atom Z670
PassMark - Single thread mark	0	95
PassMark - CPU mark	1148	158

Compare specifications (specs)

	Intel Pentium 977	Intel Atom Z670
Essentials
Architecture codename	Sandy Bridge	Lincroft
Launch date	1 April 2012	April 2011
Place in performance rating	3331	3324
Processor Number	977	Z670
Series	Legacy Intel® Pentium® Processor	Legacy Intel Atom® Processors
Status	Launched	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.40 GHz	1.50 GHz
Bus Speed	5 GT/s DMI
Die size	131 mm	65 mm
L1 cache	128 KB	64 KB (per core)
L2 cache	512 KB	512 KB (per core)
L3 cache	2048 KB
Manufacturing process technology	32 nm	45 nm
Maximum core temperature	100 °C	90
Maximum frequency	1.4 GHz	1.5 GHz
Number of cores	2	1
Number of threads	2	2
Transistor count	504 million	140 million
VID voltage range		1.1125-1.5000V
Memory
Max memory channels	2	1
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16.38 GB	2.93 GB
Supported memory types	DDR3 1066/1333	DDR2 800
Graphics
Graphics base frequency	350 MHz	400 MHz
Graphics max dynamic frequency	1.00 GHz
Graphics max frequency	1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics	Integrated
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
LVDS
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	31.0mm x 24.0mm (BGA1023)	13.8mmx13.8mm
Sockets supported	FCBGA1023	T-PBGA518
Thermal Design Power (TDP)	17 Watt	3 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
PCI support
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	Intel® SSE2, Intel® SSE3, Intel® SSSE3
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)