Intel Pentium 977 vs Intel Atom Z670
Comparative analysis of Intel Pentium 977 and Intel Atom Z670 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Pentium 977
- CPU is newer: launch date 1 year(s) 0 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- Around 11% higher maximum core temperature: 100 °C vs 90
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 5.6x more maximum memory size: 16.38 GB vs 2.93 GB
- 7.3x better performance in PassMark - CPU mark: 1148 vs 158
Specifications (specs) | |
Launch date | 1 April 2012 vs April 2011 |
Number of cores | 2 vs 1 |
Maximum core temperature | 100 °C vs 90 |
Manufacturing process technology | 32 nm vs 45 nm |
L1 cache | 128 KB vs 64 KB (per core) |
Maximum memory size | 16.38 GB vs 2.93 GB |
Benchmarks | |
PassMark - CPU mark | 1148 vs 158 |
Reasons to consider the Intel Atom Z670
- Around 7% higher clock speed: 1.5 GHz vs 1.4 GHz
- 5.7x lower typical power consumption: 3 Watt vs 17 Watt
Maximum frequency | 1.5 GHz vs 1.4 GHz |
Thermal Design Power (TDP) | 3 Watt vs 17 Watt |
Compare benchmarks
CPU 1: Intel Pentium 977
CPU 2: Intel Atom Z670
PassMark - CPU mark |
|
|
Name | Intel Pentium 977 | Intel Atom Z670 |
---|---|---|
PassMark - Single thread mark | 0 | 95 |
PassMark - CPU mark | 1148 | 158 |
Compare specifications (specs)
Intel Pentium 977 | Intel Atom Z670 | |
---|---|---|
Essentials |
||
Architecture codename | Sandy Bridge | Lincroft |
Launch date | 1 April 2012 | April 2011 |
Place in performance rating | 3321 | 3315 |
Processor Number | 977 | Z670 |
Series | Legacy Intel® Pentium® Processor | Legacy Intel Atom® Processors |
Status | Launched | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
||
64 bit support | ||
Base frequency | 1.40 GHz | 1.50 GHz |
Bus Speed | 5 GT/s DMI | |
Die size | 131 mm | 65 mm |
L1 cache | 128 KB | 64 KB (per core) |
L2 cache | 512 KB | 512 KB (per core) |
L3 cache | 2048 KB | |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 100 °C | 90 |
Maximum frequency | 1.4 GHz | 1.5 GHz |
Number of cores | 2 | 1 |
Number of threads | 2 | 2 |
Transistor count | 504 million | 140 million |
VID voltage range | 1.1125-1.5000V | |
Memory |
||
Max memory channels | 2 | 1 |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 16.38 GB | 2.93 GB |
Supported memory types | DDR3 1066/1333 | DDR2 800 |
Graphics |
||
Graphics base frequency | 350 MHz | 400 MHz |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | Integrated |
Graphics interfaces |
||
CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Wireless Display (WiDi) support | ||
LVDS | ||
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 31.0mm x 24.0mm (BGA1023) | 13.8mmx13.8mm |
Sockets supported | FCBGA1023 | T-PBGA518 |
Thermal Design Power (TDP) | 17 Watt | 3 Watt |
Peripherals |
||
Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
PCI support | ||
Security & Reliability |
||
Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | Intel® SSE2, Intel® SSE3, Intel® SSSE3 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |