Intel Pentium D 840 EE vs AMD Sempron 3300+

Comparative analysis of Intel Pentium D 840 EE and AMD Sempron 3300+ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Pentium D 840 EE

AMD Sempron 3300+

Differences

Reasons to consider the Intel Pentium D 840 EE

CPU is newer: launch date 0 month(s) later
1 more cores, run more applications at once: 2 vs 1
Around 60% higher clock speed: 3.2 GHz vs 2 GHz
8x more L2 cache, more data can be stored in the L2 cache for quick access later

Launch date	May 2005 vs April 2005
Number of cores	2 vs 1
Maximum frequency	3.2 GHz vs 2 GHz
L2 cache	2048 KB vs 256 KB
Max number of CPUs in a configuration	2 vs 1

Reasons to consider the AMD Sempron 3300+

4.6x more L1 cache, more data can be stored in the L1 cache for quick access later
2.1x lower typical power consumption: 62 Watt vs 130 Watt

L1 cache	128 KB vs 28 KB
Thermal Design Power (TDP)	62 Watt vs 130 Watt

Compare benchmarks

CPU 1: Intel Pentium D 840 EE
CPU 2: AMD Sempron 3300+

Name	Intel Pentium D 840 EE	AMD Sempron 3300+
PassMark - Single thread mark		394
PassMark - CPU mark		315

Compare specifications (specs)

	Intel Pentium D 840 EE	AMD Sempron 3300+
Essentials
Architecture codename	Smithfield	Palermo
Launch date	May 2005	April 2005
Place in performance rating	not rated	3161
Processor Number	840
Series	Legacy Intel® Pentium® Processor
Status	Discontinued
Vertical segment	Desktop	Desktop
Launch price (MSRP)		$30
Price now		$60
Value for money (0-100)		2.37
Performance
64 bit support
Base frequency	3.20 GHz
Bus Speed	800 MHz FSB
Die size	206 mm2	84 mm
L1 cache	28 KB	128 KB
L2 cache	2048 KB	256 KB
Manufacturing process technology	90 nm	90 nm
Maximum core temperature	69.8°C
Maximum frequency	3.2 GHz	2 GHz
Number of cores	2	1
Transistor count	230 million	63 million
VID voltage range	1.200-1.400V
Memory
Supported memory types	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2	1
Package Size	37.5mm x 37.5mm
Sockets supported	PLGA775	754
Thermal Design Power (TDP)	130 Watt	62 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	32-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)