Intel Pentium Dual-Core E2160 vs Intel Pentium 4 HT 631

Comparative analysis of Intel Pentium Dual-Core E2160 and Intel Pentium 4 HT 631 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Pentium Dual-Core E2160

  • 1 more cores, run more applications at once: 2 vs 1
  • 4.6x more L1 cache, more data can be stored in the L1 cache for quick access later
  • Around 32% lower typical power consumption: 65 Watt vs 86 Watt
Number of cores 2 vs 1
L1 cache 64 KB (per core) vs 28 KB
Thermal Design Power (TDP) 65 Watt vs 86 Watt

Reasons to consider the Intel Pentium 4 HT 631

  • Around 67% higher clock speed: 3 GHz vs 1.8 GHz
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency 3 GHz vs 1.8 GHz
L2 cache 2048 KB vs 1024 KB (shared)

Compare benchmarks

CPU 1: Intel Pentium Dual-Core E2160
CPU 2: Intel Pentium 4 HT 631

Name Intel Pentium Dual-Core E2160 Intel Pentium 4 HT 631
PassMark - Single thread mark 682
PassMark - CPU mark 657
Geekbench 4 - Single Core 198
Geekbench 4 - Multi-Core 347

Compare specifications (specs)

Intel Pentium Dual-Core E2160 Intel Pentium 4 HT 631

Essentials

Architecture codename Conroe Cedarmill
Launch date Q3'06 January 2006
Place in performance rating 3072 not rated
Processor Number E2160 631
Series Legacy Intel® Pentium® Processor Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 1.80 GHz 3.00 GHz
Bus Speed 800 MHz FSB 800 MHz FSB
Die size 77 mm2 81 mm2
L1 cache 64 KB (per core) 28 KB
L2 cache 1024 KB (shared) 2048 KB
Manufacturing process technology 65 nm 65 nm
Maximum core temperature 73.3°C B1+C1=69.2°C. D0=64.1°C
Maximum frequency 1.8 GHz 3 GHz
Number of cores 2 1
Transistor count 105 million 188 million
VID voltage range 0.8500V-1.5V 1.200V-1.3375V
Maximum case temperature (TCase) 69 °C

Memory

Supported memory types DDR1, DDR2, DDR3 DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm 37.5mm x 37.5mm
Sockets supported LGA775 PLGA775
Thermal Design Power (TDP) 65 Watt 86 Watt
Scenario Design Power (SDP) 0 W

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Physical Address Extensions (PAE) 32-bit

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)