Intel Pentium III 800 vs AMD Athlon XP 3200+

Comparative analysis of Intel Pentium III 800 and AMD Athlon XP 3200+ processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Pentium III 800

AMD Athlon XP 3200+

Differences

Reasons to consider the Intel Pentium III 800

3.7x lower typical power consumption: 20.8 Watt vs 77 Watt

Thermal Design Power (TDP)	20.8 Watt vs 77 Watt

Reasons to consider the AMD Athlon XP 3200+

Around 175% higher clock speed: 2.2 GHz vs 0.8 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 130 nm vs 180 nm
16x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 81% better performance in PassMark - Single thread mark: 430 vs 237
Around 54% better performance in PassMark - CPU mark: 281 vs 182

Specifications (specs)
Maximum frequency	2.2 GHz vs 0.8 GHz
Manufacturing process technology	130 nm vs 180 nm
L1 cache	128 KB vs 8 KB
L2 cache	512 KB vs 256 KB
Benchmarks
PassMark - Single thread mark	430 vs 237
PassMark - CPU mark	281 vs 182

Compare benchmarks

CPU 1: Intel Pentium III 800
CPU 2: AMD Athlon XP 3200+

PassMark - Single thread mark

CPU 1

CPU 2

237

430

PassMark - CPU mark

CPU 1

CPU 2

182

281

Name	Intel Pentium III 800	AMD Athlon XP 3200+
PassMark - Single thread mark	237	430
PassMark - CPU mark	182	281

Compare specifications (specs)

	Intel Pentium III 800	AMD Athlon XP 3200+
Essentials
Architecture codename	Coppermine T	Barton
Launch date	n/d	January 2001
Place in performance rating	3284	3119
Series	Legacy Intel® Pentium® Processor
Status	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	800 MHz
Bus Speed	133 MHz FSB
Die size	80 mm	101 mm
L1 cache	8 KB	128 KB
L2 cache	256 KB	512 KB
Manufacturing process technology	180 nm	130 nm
Maximum case temperature (TCase)	69 °C
Maximum core temperature	80°C
Maximum frequency	0.8 GHz	2.2 GHz
Number of cores	1	1
Transistor count	44 million	63 million
VID voltage range	1.75V
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Sockets supported	PPGA370, SECC2, SECC2495	A
Thermal Design Power (TDP)	20.8 Watt	77 Watt
Advanced Technologies
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)