Intel Xeon E-2254ML vs AMD Ryzen 3 PRO 3200GE
Comparative analysis of Intel Xeon E-2254ML and AMD Ryzen 3 PRO 3200GE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon E-2254ML
- 4 more threads: 8 vs 4
- Around 5% higher maximum core temperature: 100 vs 95 °C
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 40% lower typical power consumption: 25 Watt vs 35 Watt
Number of threads | 8 vs 4 |
Maximum core temperature | 100 vs 95 °C |
L3 cache | 8 MB vs 4 MB |
Thermal Design Power (TDP) | 25 Watt vs 35 Watt |
Reasons to consider the AMD Ryzen 3 PRO 3200GE
- CPU is newer: launch date 1 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 114186% higher clock speed: 4000 MHz vs 3.50 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 12 nm vs 14 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 5% better performance in PassMark - Single thread mark: 2133 vs 2029
- Around 6% better performance in PassMark - CPU mark: 6701 vs 6333
Specifications (specs) | |
Launch date | 7 July 2019 vs 27 May 2019 |
Unlocked | Unlocked vs Locked |
Maximum frequency | 4000 MHz vs 3.50 GHz |
Manufacturing process technology | 12 nm vs 14 nm |
L1 cache | 384 KB vs 256 KB |
L2 cache | 2 MB vs 1 MB |
Benchmarks | |
PassMark - Single thread mark | 2133 vs 2029 |
PassMark - CPU mark | 6701 vs 6333 |
Compare benchmarks
CPU 1: Intel Xeon E-2254ML
CPU 2: AMD Ryzen 3 PRO 3200GE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E-2254ML | AMD Ryzen 3 PRO 3200GE |
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PassMark - Single thread mark | 2029 | 2133 |
PassMark - CPU mark | 6333 | 6701 |
Compare specifications (specs)
Intel Xeon E-2254ML | AMD Ryzen 3 PRO 3200GE | |
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Essentials |
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Architecture codename | Coffee Lake | |
Launch date | 27 May 2019 | 7 July 2019 |
Launch price (MSRP) | $322 | |
Place in performance rating | 1215 | 1169 |
Processor Number | E-2254ML | |
Series | Intel Xeon E Processor | |
Status | Launched | |
Vertical segment | Embedded | Laptop |
Family | Ryzen | |
OPN PIB | YD3200C5FHBOX | |
OPN Tray | YD3200C5M4MFH | |
Performance |
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64 bit support | ||
Base frequency | 1.70 GHz | 3600 MHz |
Bus Speed | 8 GT/s | |
L1 cache | 256 KB | 384 KB |
L2 cache | 1 MB | 2 MB |
L3 cache | 8 MB | 4 MB |
Manufacturing process technology | 14 nm | 12 nm |
Maximum core temperature | 100 | 95 °C |
Maximum frequency | 3.50 GHz | 4000 MHz |
Number of cores | 4 | 4 |
Number of threads | 8 | 4 |
Number of GPU cores | 8 | |
Unlocked | ||
Memory |
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Max memory channels | 2 | 2 |
Maximum memory size | 64 GB | |
Supported memory types | DDR4-2666 | DDR4-2933 |
Graphics |
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Device ID | 0x3E94 | |
Graphics base frequency | 350 MHz | 1250 MHz |
Graphics max dynamic frequency | 1.10 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel UHD Graphics P630 | Radeon Vega 8 Graphics |
iGPU core count | 8 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@30Hz | |
Max resolution over eDP | 4096x2304@30Hz | |
Max resolution over HDMI 1.4 | 4096x2160@30Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Configurable TDP-down | 35 Watt | |
Max number of CPUs in a configuration | 1 | |
Package Size | 42mm x 28mm | |
Sockets supported | FCBGA1440 | AM4 |
Thermal Design Power (TDP) | 25 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |