Intel Xeon E3-1240L v3 vs AMD E1-2150

Comparative analysis of Intel Xeon E3-1240L v3 and AMD E1-2150 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Xeon E3-1240L v3

AMD E1-2150

Differences

Reasons to consider the Intel Xeon E3-1240L v3

2 more cores, run more applications at once: 4 vs 2
Around 186% higher clock speed: 3.00 GHz vs 1.05 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm

Number of cores	4 vs 2
Maximum frequency	3.00 GHz vs 1.05 GHz
Manufacturing process technology	22 nm vs 32 nm

Reasons to consider the AMD E1-2150

2.8x lower typical power consumption: 9 Watt vs 25 Watt

Thermal Design Power (TDP)	9 Watt vs 25 Watt

Compare benchmarks

CPU 1: Intel Xeon E3-1240L v3
CPU 2: AMD E1-2150

Name	Intel Xeon E3-1240L v3	AMD E1-2150
PassMark - Single thread mark	1745
PassMark - CPU mark	5651

Compare specifications (specs)

	Intel Xeon E3-1240L v3	AMD E1-2150
Essentials
Architecture codename	Haswell	Kabini
Launch date	Q2'14	February 2014
Place in performance rating	1448	not rated
Processor Number	E3-1240LV3
Series	Intel® Xeon® Processor E3 v3 Family
Status	Launched
Vertical segment	Server	Laptop
Performance
64 bit support
Base frequency	2.00 GHz
Bus Speed	5 GT/s DMI2
Manufacturing process technology	22 nm	32 nm
Maximum frequency	3.00 GHz	1.05 GHz
Number of cores	4	2
Number of QPI Links	0
Number of threads	8
Die size		246 mm
L1 cache		128 KB (per core)
L2 cache		512 KB (per core)
Maximum case temperature (TCase)		90 °C
Transistor count		1178 million
Memory
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3 and DDR3L 1333/1600 at 1.5V	DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1150	FT3
Thermal Design Power (TDP)	25 Watt	9 Watt
Thermal Solution	PCG 2013A
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
PCIe configurations	1x16, 2x8, 1x8/2x4
Scalability	1S Only
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)