Intel Xeon E5-2603 v3 vs Intel Xeon X5570
Comparative analysis of Intel Xeon E5-2603 v3 and Intel Xeon X5570 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E5-2603 v3
- 2 more cores, run more applications at once: 6 vs 4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- 5.3x more maximum memory size: 768 GB vs 144 GB
- Around 12% lower typical power consumption: 85 Watt vs 95 Watt
- Around 11% better performance in PassMark - CPU mark: 6900 vs 6236
Specifications (specs) | |
Number of cores | 6 vs 4 |
Manufacturing process technology | 22 nm vs 45 nm |
Maximum memory size | 768 GB vs 144 GB |
Thermal Design Power (TDP) | 85 Watt vs 95 Watt |
Benchmarks | |
PassMark - CPU mark | 6900 vs 6236 |
Reasons to consider the Intel Xeon X5570
- 2 more threads: 8 vs 6
- Around 3% higher maximum core temperature: 75°C vs 72.8°C
- Around 56% better performance in PassMark - Single thread mark: 1447 vs 925
- Around 36% better performance in Geekbench 4 - Single Core: 556 vs 410
- Around 12% better performance in Geekbench 4 - Multi-Core: 2426 vs 2164
Specifications (specs) | |
Number of threads | 8 vs 6 |
Maximum core temperature | 75°C vs 72.8°C |
Benchmarks | |
PassMark - Single thread mark | 1447 vs 925 |
Geekbench 4 - Single Core | 556 vs 410 |
Geekbench 4 - Multi-Core | 2426 vs 2164 |
Compare benchmarks
CPU 1: Intel Xeon E5-2603 v3
CPU 2: Intel Xeon X5570
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Xeon E5-2603 v3 | Intel Xeon X5570 |
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PassMark - Single thread mark | 925 | 1447 |
PassMark - CPU mark | 6900 | 6236 |
Geekbench 4 - Single Core | 410 | 556 |
Geekbench 4 - Multi-Core | 2164 | 2426 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.916 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 70.849 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.546 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.071 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 9.269 |
Compare specifications (specs)
Intel Xeon E5-2603 v3 | Intel Xeon X5570 | |
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Essentials |
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Architecture codename | Haswell | Nehalem EP |
Launch date | Q3'14 | March 2009 |
Place in performance rating | 2444 | 2442 |
Processor Number | E5-2603V3 | X5570 |
Series | Intel® Xeon® Processor E5 v3 Family | Legacy Intel® Xeon® Processors |
Status | Launched | Launched |
Vertical segment | Server | Server |
Launch price (MSRP) | $49 | |
Price now | $89 | |
Value for money (0-100) | 18.79 | |
Performance |
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64 bit support | ||
Base frequency | 1.60 GHz | 2.93 GHz |
Bus Speed | 6.4 GT/s QPI | 6.4 GT/s QPI |
Manufacturing process technology | 22 nm | 45 nm |
Maximum core temperature | 72.8°C | 75°C |
Number of cores | 6 | 4 |
Number of QPI Links | 2 | 2 |
Number of threads | 6 | 8 |
VID voltage range | 0.65V–1.30V | 0.75V -1.35V |
Die size | 263 mm2 | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 8192 KB (shared) | |
Maximum frequency | 3.33 GHz | |
Transistor count | 731 million | |
Memory |
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Max memory channels | 4 | 3 |
Maximum memory bandwidth | 51 GB/s | 32 GB/s |
Maximum memory size | 768 GB | 144 GB |
Supported memory types | DDR4 1600 | DDR3 800/1066/1333 |
ECC memory support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 2 |
Package Size | 52.5mm x 45mm | 42.5mm x 45mm |
Sockets supported | FCLGA2011-3 | FCLGA1366 |
Thermal Design Power (TDP) | 85 Watt | 95 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | 40-bit |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |