Intel Xeon E5-2690 v3 vs AMD Ryzen Threadripper 2900X

Comparative analysis of Intel Xeon E5-2690 v3 and AMD Ryzen Threadripper 2900X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.

 

Differences

Reasons to consider the Intel Xeon E5-2690 v3

  • 4 more cores, run more applications at once: 12 vs 8
  • Around 13% higher clock speed: 3.50 GHz vs 3.1 GHz
Number of cores 12 vs 8
Maximum frequency 3.50 GHz vs 3.1 GHz
Max number of CPUs in a configuration 2 vs 1

Reasons to consider the AMD Ryzen Threadripper 2900X

  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
  • Around 8% lower typical power consumption: 125 Watt vs 135 Watt
Unlocked Unlocked vs Locked
Manufacturing process technology 14 nm vs 22 nm
Thermal Design Power (TDP) 125 Watt vs 135 Watt

Compare benchmarks

CPU 1: Intel Xeon E5-2690 v3
CPU 2: AMD Ryzen Threadripper 2900X

Name Intel Xeon E5-2690 v3 AMD Ryzen Threadripper 2900X
PassMark - Single thread mark 1916
PassMark - CPU mark 26340
Geekbench 4 - Single Core 834
Geekbench 4 - Multi-Core 8521
3DMark Fire Strike - Physics Score 5995

Compare specifications (specs)

Intel Xeon E5-2690 v3 AMD Ryzen Threadripper 2900X

Essentials

Architecture codename Haswell Zen
Launch date Q3'14 August 2018
Place in performance rating 1194 not rated
Processor Number E5-2690V3
Series Intel® Xeon® Processor E5 v3 Family
Status Launched
Vertical segment Server Desktop

Performance

64 bit support
Base frequency 2.60 GHz
Bus Speed 9.6 GT/s QPI
Manufacturing process technology 22 nm 14 nm
Maximum core temperature 89.9°C
Maximum frequency 3.50 GHz 3.1 GHz
Number of cores 12 8
Number of QPI Links 2
Number of threads 24
VID voltage range 0.65V–1.30V
Die size 213 mm
L1 cache 96 KB (per core)
L2 cache 512 KB (per core)
L3 cache 32768 KB
Transistor count 9600 million
Unlocked

Memory

Max memory channels 4
Maximum memory bandwidth 68 GB/s
Maximum memory size 768 GB
Supported memory types DDR4 1600/1866/2133 DDR4

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 52.5mm x 45mm
Sockets supported FCLGA2011-3
Thermal Design Power (TDP) 135 Watt 125 Watt

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)