Intel Xeon E7-8850 v2 vs Intel Pentium 4 HT 631

Comparative analysis of Intel Xeon E7-8850 v2 and Intel Pentium 4 HT 631 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.

Intel Xeon E7-8850 v2

Intel Pentium 4 HT 631

Differences

Reasons to consider the Intel Xeon E7-8850 v2

11 more cores, run more applications at once: 12 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm

Number of cores	12 vs 1
Manufacturing process technology	22 nm vs 65 nm
Max number of CPUs in a configuration	8 vs 1

Reasons to consider the Intel Pentium 4 HT 631

Around 7% higher clock speed: 3 GHz vs 2.80 GHz
Around 22% lower typical power consumption: 86 Watt vs 105 Watt

Maximum frequency	3 GHz vs 2.80 GHz
Thermal Design Power (TDP)	86 Watt vs 105 Watt

Compare specifications (specs)

	Intel Xeon E7-8850 v2	Intel Pentium 4 HT 631
Essentials
Architecture codename	Ivy Bridge	Cedarmill
Launch date	Q1'14	January 2006
Place in performance rating	not rated	not rated
Processor Number	E7-8850V2	631
Series	Intel® Xeon® Processor E7 v2 Family	Legacy Intel® Pentium® Processor
Status	Launched	Discontinued
Vertical segment	Server	Desktop
Performance
64 bit support
Base frequency	2.30 GHz	3.00 GHz
Bus Speed	7.2 GT/s QPI	800 MHz FSB
Manufacturing process technology	22 nm	65 nm
Maximum core temperature	68°C	B1+C1=69.2°C. D0=64.1°C
Maximum frequency	2.80 GHz	3 GHz
Number of cores	12	1
Number of QPI Links	3
Number of threads	24
Die size		81 mm2
L1 cache		28 KB
L2 cache		2048 KB
Maximum case temperature (TCase)		69 °C
Transistor count		188 million
VID voltage range		1.200V-1.3375V
Memory
Max memory channels	4
Maximum memory bandwidth	68 GB/s
Maximum memory size	1.5 TB
Supported memory types	DDR3 1066/1333/1600	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	8	1
Package Size	52mm x 45mm	37.5mm x 37.5mm
Sockets supported	FCLGA2011	PLGA775
Thermal Design Power (TDP)	105 Watt	86 Watt
Scenario Design Power (SDP)		0 W
Peripherals
Max number of PCIe lanes	32
PCI Express revision	3.0
PCIe configurations	x4, x8, x16
Scalability	S8S
Security & Reliability
Execute Disable Bit (EDB)
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Instruction Replay Technology
Intel® TSX-NI
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	46-bit	32-bit
Thermal Monitoring
FSB parity
Intel® Demand Based Switching
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)