Intel Xeon Platinum 8160T vs Intel Pentium D 965 EE

Comparative analysis of Intel Xeon Platinum 8160T and Intel Pentium D 965 EE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.

 

Differences

Reasons to consider the Intel Xeon Platinum 8160T

  • 22 more cores, run more applications at once: 24 vs 2
  • Around 36% higher maximum core temperature: 93°C vs 68.6°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 65 nm
Number of cores 24 vs 2
Maximum core temperature 93°C vs 68.6°C
Manufacturing process technology 14 nm vs 65 nm

Reasons to consider the Intel Pentium D 965 EE

  • Around 1% higher clock speed: 3.73 GHz vs 3.70 GHz
  • Around 15% lower typical power consumption: 130 Watt vs 150 Watt
Maximum frequency 3.73 GHz vs 3.70 GHz
Thermal Design Power (TDP) 130 Watt vs 150 Watt

Compare specifications (specs)

Intel Xeon Platinum 8160T Intel Pentium D 965 EE

Essentials

Architecture codename Skylake Presler
Launch date Q3'17 March 2006
Place in performance rating not rated not rated
Processor Number 8160T 965
Series Intel® Xeon® Scalable Processors Legacy Intel® Pentium® Processor
Status Launched Discontinued
Vertical segment Server Desktop

Performance

Base frequency 2.10 GHz 3.73 GHz
Manufacturing process technology 14 nm 65 nm
Maximum core temperature 93°C 68.6°C
Maximum frequency 3.70 GHz 3.73 GHz
Number of cores 24 2
Number of threads 48
Number of Ultra Path Interconnect (UPI) Links 3
64 bit support
Bus Speed 1066 MHz FSB
Die size 162 mm2
L1 cache 28 KB
L2 cache 4096 KB
Transistor count 376 million
VID voltage range 1.200V-1.3375V

Memory

Max memory channels 6
Maximum memory size 768 GB
Supported memory frequency 2666 MHz
Supported memory types DDR4-2666 DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Package Size 76.0mm x 56.5mm 37.5mm x 37.5mm
Sockets supported FCLGA3647 PLGA775
Thermal Design Power (TDP) 150 Watt 130 Watt
Max number of CPUs in a configuration 2

Peripherals

Max number of PCIe lanes 48
PCI Express revision 3.0
Scalability S8S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Instruction set extensions Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units 2
Speed Shift technology
FSB parity
Idle States
Intel® Demand Based Switching
Physical Address Extensions (PAE) 32-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)