Intel Xeon W-1270E vs AMD Ryzen 9 6900HS
Comparative analysis of Intel Xeon W-1270E and AMD Ryzen 9 6900HS processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Xeon W-1270E
- Around 5% higher maximum core temperature: 100°C vs 95 °C
Maximum core temperature | 100°C vs 95 °C |
Reasons to consider the AMD Ryzen 9 6900HS
- Around 2% higher clock speed: 4.9 GHz vs 4.80 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 14 nm
- 2.3x lower typical power consumption: 35 Watt vs 80 Watt
- Around 10% better performance in PassMark - Single thread mark: 3285 vs 2990
- Around 27% better performance in PassMark - CPU mark: 23581 vs 18635
Specifications (specs) | |
Maximum frequency | 4.9 GHz vs 4.80 GHz |
Manufacturing process technology | 6 nm vs 14 nm |
Thermal Design Power (TDP) | 35 Watt vs 80 Watt |
Benchmarks | |
PassMark - Single thread mark | 3285 vs 2990 |
PassMark - CPU mark | 23581 vs 18635 |
Compare benchmarks
CPU 1: Intel Xeon W-1270E
CPU 2: AMD Ryzen 9 6900HS
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon W-1270E | AMD Ryzen 9 6900HS |
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PassMark - Single thread mark | 2990 | 3285 |
PassMark - CPU mark | 18635 | 23581 |
3DMark Fire Strike - Physics Score | 6900 |
Compare specifications (specs)
Intel Xeon W-1270E | AMD Ryzen 9 6900HS | |
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Essentials |
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Architecture codename | Comet Lake | Zen 3+ |
Launch date | Q2'20 | Jan 2022 |
Launch price (MSRP) | $404 | |
Place in performance rating | 606 | 611 |
Processor Number | W-1270E | |
Series | Intel Xeon W Processor | |
Vertical segment | Embedded | Mobile |
Performance |
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64 bit support | ||
Base frequency | 3.40 GHz | 3.3 GHz |
Bus Speed | 8 GT/s | |
L3 cache | 16 MB | 16 MB |
Manufacturing process technology | 14 nm | 6 nm |
Maximum core temperature | 100°C | 95 °C |
Maximum frequency | 4.80 GHz | 4.9 GHz |
Number of cores | 8 | 8 |
Number of threads | 16 | 16 |
Die size | 208 mm² | |
L1 cache | 512 KB | |
L2 cache | 4 MB | |
Unlocked | ||
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 45.8 GB/s | |
Maximum memory size | 128 GB | |
Supported memory types | DDR4-2933 | DDR5-4800 |
ECC memory support | ||
Graphics |
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Device ID | 0x9BC6 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.20 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel UHD Graphics 630 | |
Graphics max frequency | 2400 MHz | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1200 | FP7 |
Thermal Design Power (TDP) | 80 Watt | 35 Watt |
Thermal Solution | PCG 2015W | |
Peripherals |
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Max number of PCIe lanes | 16 | 20 |
PCI Express revision | 3.0 | 4.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
AMD SenseMI | ||
AMD StoreMI technology | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |