Intel Xeon W-1270P vs AMD Ryzen 9 PRO 3900
Comparative analysis of Intel Xeon W-1270P and AMD Ryzen 9 PRO 3900 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Xeon W-1270P
- CPU is newer: launch date 6 month(s) later
- Around 19% higher clock speed: 5.10 GHz vs 4.3 GHz
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- Around 9% better performance in PassMark - Single thread mark: 2916 vs 2681
Specifications (specs) | |
Launch date | 1 Apr 2020 vs 30 Sep 2019 |
Maximum frequency | 5.10 GHz vs 4.3 GHz |
Maximum core temperature | 100°C vs 95 °C |
Benchmarks | |
PassMark - Single thread mark | 2916 vs 2681 |
Reasons to consider the AMD Ryzen 9 PRO 3900
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 4 more cores, run more applications at once: 12 vs 8
- 8 more threads: 24 vs 16
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 4x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 92% lower typical power consumption: 65 Watt vs 125 Watt
- Around 85% better performance in PassMark - CPU mark: 31616 vs 17113
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Number of cores | 12 vs 8 |
Number of threads | 24 vs 16 |
Manufacturing process technology | 7 nm vs 14 nm |
L3 cache | 64 MB vs 16 MB |
Thermal Design Power (TDP) | 65 Watt vs 125 Watt |
Benchmarks | |
PassMark - CPU mark | 31616 vs 17113 |
Compare benchmarks
CPU 1: Intel Xeon W-1270P
CPU 2: AMD Ryzen 9 PRO 3900
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon W-1270P | AMD Ryzen 9 PRO 3900 |
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PassMark - Single thread mark | 2916 | 2681 |
PassMark - CPU mark | 17113 | 31616 |
3DMark Fire Strike - Physics Score | 7891 |
Compare specifications (specs)
Intel Xeon W-1270P | AMD Ryzen 9 PRO 3900 | |
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Essentials |
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Architecture codename | Comet Lake | Zen 2 |
Launch date | 1 Apr 2020 | 30 Sep 2019 |
Launch price (MSRP) | $428 - $431 | |
Place in performance rating | 655 | 656 |
Processor Number | W-1270P | PRO 3900 |
Series | Intel Xeon W Processor | |
Status | Launched | |
Vertical segment | Workstation | Desktop |
Family | Ryzen 9 | |
OPN Tray | 100-000000072 | |
Performance |
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64 bit support | ||
Base frequency | 3.80 GHz | 3.1 GHz |
Bus Speed | 8 GT/s | |
L3 cache | 16 MB | 64 MB |
Manufacturing process technology | 14 nm | 7 nm |
Maximum core temperature | 100°C | 95 °C |
Maximum frequency | 5.10 GHz | 4.3 GHz |
Number of cores | 8 | 12 |
Number of threads | 16 | 24 |
L1 cache | 768 KB | |
L2 cache | 6 MB | |
Unlocked | ||
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 45.8 GB/s | 47.68 GB/s |
Maximum memory size | 128 GB | 128 GB |
Supported memory types | DDR4-2933 | DDR4-3200 |
Graphics |
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Device ID | 0x9BC6 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.20 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel UHD Graphics P630 | |
Graphics interfaces |
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Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Configurable TDP-down | 95 Watt | |
Configurable TDP-down Frequency | 3.50 GHz | |
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1200 | AM4 |
Thermal Design Power (TDP) | 125 Watt | 65 Watt |
Thermal Solution | PCG 2015D | |
Peripherals |
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Max number of PCIe lanes | 16 | 20 |
PCI Express revision | 3.0 | 4.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x16+x4, 2x8+x4, 1x8+2x4+x4 |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Thermal Velocity Boost | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |