Intel Xeon W-2255 vs AMD Ryzen 7 PRO 3700
Comparative analysis of Intel Xeon W-2255 and AMD Ryzen 7 PRO 3700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Xeon W-2255
- 2 more cores, run more applications at once: 10 vs 8
- 4 more threads: 20 vs 16
- Around 2% higher clock speed: 4.50 GHz vs 4.4 GHz
- Around 25% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2.5x more L2 cache, more data can be stored in the L2 cache for quick access later
- 8x more maximum memory size: 1 TB vs 128 GB
| Specifications (specs) | |
| Number of cores | 10 vs 8 |
| Number of threads | 20 vs 16 |
| Maximum frequency | 4.50 GHz vs 4.4 GHz |
| L1 cache | 640 KB vs 512 KB |
| L2 cache | 10 MB vs 4 MB |
| Maximum memory size | 1 TB vs 128 GB |
| Benchmarks | |
| PassMark - Single thread mark | 2692 vs 2681 |
Reasons to consider the AMD Ryzen 7 PRO 3700
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 53% higher maximum core temperature: 95 °C vs 62°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- Around 66% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2.5x lower typical power consumption: 65 Watt vs 165 Watt
- Around 2% better performance in PassMark - CPU mark: 22830 vs 22408
| Specifications (specs) | |
| Unlocked | Unlocked vs Locked |
| Maximum core temperature | 95 °C vs 62°C |
| Manufacturing process technology | 7 nm vs 14 nm |
| L3 cache | 32 MB vs 19.25 MB |
| Thermal Design Power (TDP) | 65 Watt vs 165 Watt |
| Benchmarks | |
| PassMark - CPU mark | 22830 vs 22408 |
Compare benchmarks
CPU 1: Intel Xeon W-2255
CPU 2: AMD Ryzen 7 PRO 3700
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Xeon W-2255 | AMD Ryzen 7 PRO 3700 |
|---|---|---|
| PassMark - Single thread mark | 2692 | 2681 |
| PassMark - CPU mark | 22408 | 22830 |
Compare specifications (specs)
| Intel Xeon W-2255 | AMD Ryzen 7 PRO 3700 | |
|---|---|---|
Essentials |
||
| Architecture codename | Cascade Lake | Zen 2 |
| Launch date | 7 Oct 2019 | 30 Sep 2019 |
| Launch price (MSRP) | $778 | |
| Place in performance rating | 698 | 699 |
| Processor Number | W-2255 | PRO 3700 |
| Series | Intel Xeon W Processor | 3000 |
| Status | Launched | |
| Vertical segment | Workstation | Desktop |
| Family | Ryzen 7 | |
| OPN Tray | 100-000000073 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.70 GHz | 3.6 GHz |
| Bus Speed | 8 GT/s | |
| L1 cache | 640 KB | 512 KB |
| L2 cache | 10 MB | 4 MB |
| L3 cache | 19.25 MB | 32 MB |
| Manufacturing process technology | 14 nm | 7 nm |
| Maximum core temperature | 62°C | 95 °C |
| Maximum frequency | 4.50 GHz | 4.4 GHz |
| Number of cores | 10 | 8 |
| Number of QPI Links | 0 | |
| Number of threads | 20 | 16 |
| Number of Ultra Path Interconnect (UPI) Links | 0 | |
| Unlocked | ||
Memory |
||
| Max memory channels | 4 | 2 |
| Maximum memory bandwidth | 93.85 GB/s | 47.68 GB/s |
| Maximum memory size | 1 TB | 128 GB |
| Supported memory types | DDR4 2933 | DDR4-3200 |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 45mm x 52.5mm | |
| Sockets supported | FCLGA2066 | AM4 |
| Thermal Design Power (TDP) | 165 Watt | 65 Watt |
Peripherals |
||
| Max number of PCIe lanes | 48 | 20 |
| PCI Express revision | 3.0 | 4.0 |
| PCIe configurations | x4, x8, x16 | 1x16+x4, 2x8+x4, 1x8+2x4+x4 |
| Scalability | 1S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Intel® vPro™ Platform Eligibility | ||
| Number of AVX-512 FMA Units | 2 | |
| Physical Address Extensions (PAE) | 46-bit | |
| Speed Shift technology | ||
| Thermal Monitoring | ||
| AMD SenseMI | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||