Intel Xeon W-3223 vs AMD Ryzen 9 3900X
Comparative analysis of Intel Xeon W-3223 and AMD Ryzen 9 3900X processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon W-3223
- Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
L2 cache | 8 MB vs 6 MB |
Reasons to consider the AMD Ryzen 9 3900X
- CPU is newer: launch date 1 month(s) later
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 4 more cores, run more applications at once: 12 vs 8
- 8 more threads: 24 vs 16
- Around 114900% higher clock speed: 4600 MHz vs 4.00 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 3.9x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 52% lower typical power consumption: 105 Watt vs 160 Watt
- Around 23% better performance in Geekbench 4 - Single Core: 1276 vs 1037
- Around 48% better performance in Geekbench 4 - Multi-Core: 12037 vs 8149
- Around 10% better performance in PassMark - Single thread mark: 2707 vs 2450
- Around 91% better performance in PassMark - CPU mark: 32657 vs 17141
Specifications (specs) | |
Launch date | 7 July 2019 vs 3 Jun 2019 |
Unlocked | Unlocked vs Locked |
Number of cores | 12 vs 8 |
Number of threads | 24 vs 16 |
Maximum frequency | 4600 MHz vs 4.00 GHz |
Manufacturing process technology | 7 nm vs 14 nm |
L3 cache | 64 MB vs 16.5 MB |
Thermal Design Power (TDP) | 105 Watt vs 160 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 1276 vs 1037 |
Geekbench 4 - Multi-Core | 12037 vs 8149 |
PassMark - Single thread mark | 2707 vs 2450 |
PassMark - CPU mark | 32657 vs 17141 |
Compare benchmarks
CPU 1: Intel Xeon W-3223
CPU 2: AMD Ryzen 9 3900X
Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon W-3223 | AMD Ryzen 9 3900X |
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Geekbench 4 - Single Core | 1037 | 1276 |
Geekbench 4 - Multi-Core | 8149 | 12037 |
PassMark - Single thread mark | 2450 | 2707 |
PassMark - CPU mark | 17141 | 32657 |
3DMark Fire Strike - Physics Score | 8594 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 30.575 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 72.097 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 1.745 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.887 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 22.686 |
Compare specifications (specs)
Intel Xeon W-3223 | AMD Ryzen 9 3900X | |
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Essentials |
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Architecture codename | Cascade Lake | Zen 2 |
Launch date | 3 Jun 2019 | 7 July 2019 |
Launch price (MSRP) | $749 | |
Place in performance rating | 1005 | 1006 |
Processor Number | W-3223 | |
Series | Intel Xeon W Processor | |
Status | Launched | |
Vertical segment | Workstation | Desktop |
Family | Ryzen | |
OPN PIB | 100-100000023BOX | |
OPN Tray | 100-000000023 | |
Performance |
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Base frequency | 3.50 GHz | 3800 MHz |
L1 cache | 512 KB | |
L2 cache | 8 MB | 6 MB |
L3 cache | 16.5 MB | 64 MB |
Manufacturing process technology | 14 nm | 7 nm |
Maximum core temperature | 68°C | |
Maximum frequency | 4.00 GHz | 4600 MHz |
Number of cores | 8 | 12 |
Number of threads | 16 | 24 |
Number of Ultra Path Interconnect (UPI) Links | 0 | |
Unlocked | ||
Memory |
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Max memory channels | 6 | 2 |
Maximum memory size | 1 TB | |
Supported memory frequency | 2666 MHz | |
Supported memory types | DDR4-2666 | DDR4-3200 |
Compatibility |
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Package Size | 76.0mm x 56.5mm | |
Sockets supported | FCLGA3647 | AM4 |
Thermal Design Power (TDP) | 160 Watt | 105 Watt |
Peripherals |
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Max number of PCIe lanes | 64 | |
PCI Express revision | 3.0 | 4.0 |
Scalability | 1S Only | |
PCIe configurations | x16 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 2 | |
Speed Shift technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |