Intel Xeon X5460 vs Intel Pentium III 1266S

Comparative analysis of Intel Xeon X5460 and Intel Pentium III 1266S processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: 3DMark Fire Strike - Physics Score, PassMark - Single thread mark, PassMark - CPU mark.

Intel Xeon X5460

Intel Pentium III 1266S

Differences

Reasons to consider the Intel Xeon X5460

3 more cores, run more applications at once: 4 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 130 nm
32x more L1 cache, more data can be stored in the L1 cache for quick access later
24x more L2 cache, more data can be stored in the L2 cache for quick access later

Number of cores	4 vs 1
Manufacturing process technology	45 nm vs 130 nm
L1 cache	256 KB vs 8 KB
L2 cache	12 MB vs 512 KB

Reasons to consider the Intel Pentium III 1266S

4x lower typical power consumption: 30.4 Watt vs 120 Watt

Thermal Design Power (TDP)	30.4 Watt vs 120 Watt

Compare benchmarks

CPU 1: Intel Xeon X5460
CPU 2: Intel Pentium III 1266S

Name	Intel Xeon X5460	Intel Pentium III 1266S
3DMark Fire Strike - Physics Score	0
PassMark - Single thread mark		0
PassMark - CPU mark		309

Compare specifications (specs)

	Intel Xeon X5460	Intel Pentium III 1266S
Essentials
Architecture codename	Harpertown	Tualatin
Launch date	12 Nov 2007	Q4'01
Launch price (MSRP)	$1172
Place in performance rating	3368	3365
Processor Number	X5460
Vertical segment	Server	Server
Series		Legacy Intel® Pentium® Processor
Status		Discontinued
Performance
64 bit support
Base frequency	3.16 GHz	1.26 GHz
Bus Speed	1333 MHz	133 MHz FSB
L1 cache	256 KB	8 KB
L2 cache	12 MB	512 KB
Manufacturing process technology	45 nm	130 nm
Maximum case temperature (TCase)	63 °C	69 °C
Number of cores	4	1
Number of threads	4
Transistor count	820 million	44 million
VID voltage range	0.85V - 1.35V	1.5V
Die size		80 mm
Maximum core temperature		69°C
Maximum frequency		1.27 GHz
Compatibility
Sockets supported	LGA771	PPGA370
Thermal Design Power (TDP)	120 Watt	30.4 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® VT-x with Extended Page Tables (EPT)