AMD FirePro M3900 videocard review

AMD FirePro M3900

FirePro M3900 videocard released by AMD; release date: 19 October 2010. The videocard is designed for mobile workstation-computers and based on TeraScale 2 microarchitecture codenamed Seymour.

Core clock speed - 750 MHz. Boost clock speed - 750 MHz. Texture fill rate - 6 GTexel / s. Pipelines - 160. Floating-point performance - 240 gflops. Manufacturing process technology - 40 nm. Transistors count - 370 million. Power consumption (TDP) - 20 Watt.

Memory type: GDDR3. Maximum RAM amount - 1 GB. Memory bus width - 64 Bit. Memory clock speed - 1800 MHz. Memory bandwidth - 14 GB / s. Shared memory - 0.

Benchmarks

Geekbench
OpenCL
Top 1 GPU
This GPU
345616
4446
Name Value
Geekbench - OpenCL 4446

Specifications (specs)

Essentials

Architecture TeraScale 2
Code name Seymour
Launch date 19 October 2010
Place in performance rating 1660
Type Mobile workstation

Technical info

Boost clock speed 750 MHz
Core clock speed 750 MHz
Floating-point performance 240 gflops
Manufacturing process technology 40 nm
Pipelines 160
Texture fill rate 6 GTexel / s
Thermal Design Power (TDP) 20 Watt
Transistor count 370 million

Video outputs and ports

Display Connectors No outputs

Compatibility, dimensions and requirements

Bus support n / a
Form factor chip-down
Interface PCIe 2.0 x16

API support

DirectX 11.2 (11_0)
OpenGL 4.4

Memory

Maximum RAM amount 1 GB
Memory bandwidth 14 GB / s
Memory bus width 64 Bit
Memory clock speed 1800 MHz
Memory type GDDR3
Shared memory 0

Technologies

AMD Eyefinity