AMD FirePro M3900 videocard review

FirePro M3900 videocard released by AMD; release date: 19 October 2010. The videocard is designed for mobile workstation-computers and based on TeraScale 2 microarchitecture codenamed Seymour.

Core clock speed - 750 MHz. Boost clock speed - 750 MHz. Texture fill rate - 6 GTexel / s. Pipelines - 160. Floating-point performance - 240 gflops. Manufacturing process technology - 40 nm. Transistors count - 370 million. Power consumption (TDP) - 20 Watt.

Memory type: GDDR3. Maximum RAM amount - 1 GB. Memory bus width - 64 Bit. Memory clock speed - 1800 MHz. Memory bandwidth - 14 GB / s. Shared memory - 0.

Benchmarks

Geekbench
OpenCL

Top 1 GPU

This GPU

345150

4446

Name	Value
Geekbench - OpenCL	4446

Specifications (specs)

Essentials
Architecture	TeraScale 2
Code name	Seymour
Launch date	19 October 2010
Place in performance rating	1660
Type	Mobile workstation
Technical info
Boost clock speed	750 MHz
Core clock speed	750 MHz
Floating-point performance	240 gflops
Manufacturing process technology	40 nm
Pipelines	160
Texture fill rate	6 GTexel / s
Thermal Design Power (TDP)	20 Watt
Transistor count	370 million

Video outputs and ports
Display Connectors	No outputs
Compatibility, dimensions and requirements
Bus support	n / a
Form factor	chip-down
Interface	PCIe 2.0 x16
API support
DirectX	11.2 (11_0)
OpenGL	4.4
Memory
Maximum RAM amount	1 GB
Memory bandwidth	14 GB / s
Memory bus width	64 Bit
Memory clock speed	1800 MHz
Memory type	GDDR3
Shared memory	0
Technologies
AMD Eyefinity