AMD FirePro M3900 vs NVIDIA GeForce G103M

Comparative analysis of AMD FirePro M3900 and NVIDIA GeForce G103M videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G2D Mark, PassMark - G3D Mark.

AMD FirePro M3900

NVIDIA GeForce G103M

Differences

Reasons to consider the AMD FirePro M3900

Videocard is newer: launch date 1 year(s) 1 month(s) later
Around 17% higher core clock speed: 750 MHz vs 640 MHz
Around 17% higher texture fill rate: 6 GTexel / s vs 5.12 GTexel / s
20x more pipelines: 160 vs 8
9.4x better floating-point performance: 240 gflops vs 25.6 gflops
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 65 nm
2x more maximum memory size: 1 GB vs 512 MB
Around 80% higher memory clock speed: 1800 MHz vs 1000 MHz

Launch date	19 October 2010 vs 1 September 2009
Core clock speed	750 MHz vs 640 MHz
Texture fill rate	6 GTexel / s vs 5.12 GTexel / s
Pipelines	160 vs 8
Floating-point performance	240 gflops vs 25.6 gflops
Manufacturing process technology	40 nm vs 65 nm
Maximum memory size	1 GB vs 512 MB
Memory clock speed	1800 MHz vs 1000 MHz

Reasons to consider the NVIDIA GeForce G103M

Around 43% lower typical power consumption: 14 Watt vs 20 Watt

Thermal Design Power (TDP)	14 Watt vs 20 Watt

Compare benchmarks

GPU 1: AMD FirePro M3900
GPU 2: NVIDIA GeForce G103M

Name	AMD FirePro M3900	NVIDIA GeForce G103M
Geekbench - OpenCL	4446
PassMark - G2D Mark		34
PassMark - G3D Mark		63

Compare specifications (specs)

	AMD FirePro M3900	NVIDIA GeForce G103M
Essentials
Architecture	TeraScale 2	Tesla
Code name	Seymour	G98
Launch date	19 October 2010	1 September 2009
Place in performance rating	1661	1663
Type	Mobile workstation	Desktop
Technical info
Boost clock speed	750 MHz
Core clock speed	750 MHz	640 MHz
Floating-point performance	240 gflops	25.6 gflops
Manufacturing process technology	40 nm	65 nm
Pipelines	160	8
Texture fill rate	6 GTexel / s	5.12 GTexel / s
Thermal Design Power (TDP)	20 Watt	14 Watt
Transistor count	370 million	210 million
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Bus support	n / a
Form factor	chip-down
Interface	PCIe 2.0 x16	PCIe 1.0 x16
API support
DirectX	11.2 (11_0)	10.0
OpenGL	4.4	3.3
Memory
Maximum RAM amount	1 GB	512 MB
Memory bandwidth	14 GB / s	8 GB / s
Memory bus width	64 Bit	64 Bit
Memory clock speed	1800 MHz	1000 MHz
Memory type	GDDR3	DDR2
Shared memory	0
Technologies
AMD Eyefinity