NVIDIA GeForce GTX 560 Ti X2 vs AMD FirePro M3900

Comparative analysis of NVIDIA GeForce GTX 560 Ti X2 and AMD FirePro M3900 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: CompuBench 1.5 Desktop - T-Rex (Frames/s), Geekbench - OpenCL.

NVIDIA GeForce GTX 560 Ti X2

AMD FirePro M3900

Differences

Reasons to consider the NVIDIA GeForce GTX 560 Ti X2

Videocard is newer: launch date 3 month(s) later
Around 13% higher core clock speed: 850 MHz vs 750 MHz
42.4x more texture fill rate: 2x 54.4 GTexel / s billion / sec vs 6 GTexel / s
4.8x more pipelines: 2x 384 vs 160
10.9x better floating-point performance: 2x 1,305.6 gflops vs 240 gflops
2x more maximum memory size: 2x 1 GB vs 1 GB
2.2x more memory clock speed: 4008 MHz vs 1800 MHz

Launch date	25 January 2011 vs 19 October 2010
Core clock speed	850 MHz vs 750 MHz
Texture fill rate	2x 54.4 GTexel / s billion / sec vs 6 GTexel / s
Pipelines	2x 384 vs 160
Floating-point performance	2x 1,305.6 gflops vs 240 gflops
Maximum memory size	2x 1 GB vs 1 GB
Memory clock speed	4008 MHz vs 1800 MHz

Reasons to consider the AMD FirePro M3900

8.5x lower typical power consumption: 20 Watt vs 170 Watt

Thermal Design Power (TDP)	20 Watt vs 170 Watt

Compare benchmarks

GPU 1: NVIDIA GeForce GTX 560 Ti X2
GPU 2: AMD FirePro M3900

Name	NVIDIA GeForce GTX 560 Ti X2	AMD FirePro M3900
CompuBench 1.5 Desktop - T-Rex (Frames/s)	1.3
Geekbench - OpenCL		4446

Compare specifications (specs)

	NVIDIA GeForce GTX 560 Ti X2	AMD FirePro M3900
Essentials
Architecture	Fermi 2.0	TeraScale 2
Code name	GF114	Seymour
Launch date	25 January 2011	19 October 2010
Place in performance rating	1659	1660
Type	Desktop	Mobile workstation
Technical info
Core clock speed	850 MHz	750 MHz
Floating-point performance	2x 1,305.6 gflops	240 gflops
Manufacturing process technology	40 nm	40 nm
Pipelines	2x 384	160
Texture fill rate	2x 54.4 GTexel / s billion / sec	6 GTexel / s
Thermal Design Power (TDP)	170 Watt	20 Watt
Transistor count	1,950 million	370 million
Boost clock speed		750 MHz
Video outputs and ports
Display Connectors	3x DVI, 1x mini-HDMI	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 2.0 x16	PCIe 2.0 x16
Length	292 mm
Supplementary power connectors	2x 8-pin
Bus support		n / a
Form factor		chip-down
API support
DirectX	12.0 (11_0)	11.2 (11_0)
OpenGL	4.6	4.4
Memory
Maximum RAM amount	2x 1 GB	1 GB
Memory bandwidth	2x 128.3 GB / s	14 GB / s
Memory bus width	2x 256 Bit	64 Bit
Memory clock speed	4008 MHz	1800 MHz
Memory type	GDDR5	GDDR3
Shared memory		0
Technologies
AMD Eyefinity