AMD FirePro S9300 X2 vs AMD Radeon R5 235X OEM

Comparative analysis of AMD FirePro S9300 X2 and AMD Radeon R5 235X OEM videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL, PassMark - G2D Mark, PassMark - G3D Mark.

AMD FirePro S9300 X2

AMD Radeon R5 235X OEM

Differences

Reasons to consider the AMD FirePro S9300 X2

Videocard is newer: launch date 2 year(s) 3 month(s) later
316.8x more texture fill rate: 2x 217.6 GTexel / s billion / sec vs 7 GTexel / s
51.2x more pipelines: 2x 4096 vs 160
49.7x better floating-point performance: 2x 6,963 gflops vs 280.0 gflops
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 28 nm vs 40 nm
8x more maximum memory size: 2x 4 GB vs 1 GB

Launch date	31 March 2016 vs 21 December 2013
Texture fill rate	2x 217.6 GTexel / s billion / sec vs 7 GTexel / s
Pipelines	2x 4096 vs 160
Floating-point performance	2x 6,963 gflops vs 280.0 gflops
Manufacturing process technology	28 nm vs 40 nm
Maximum memory size	2x 4 GB vs 1 GB

Reasons to consider the AMD Radeon R5 235X OEM

Around 3% higher core clock speed: 875 MHz vs 850 MHz
16.7x lower typical power consumption: 18 Watt vs 300 Watt
Around 80% higher memory clock speed: 1800 MHz vs 1000 MHz

Core clock speed	875 MHz vs 850 MHz
Thermal Design Power (TDP)	18 Watt vs 300 Watt
Memory clock speed	1800 MHz vs 1000 MHz

Compare benchmarks

GPU 1: AMD FirePro S9300 X2
GPU 2: AMD Radeon R5 235X OEM

Name	AMD FirePro S9300 X2	AMD Radeon R5 235X OEM
Geekbench - OpenCL	27971
PassMark - G2D Mark		202
PassMark - G3D Mark		277

Compare specifications (specs)

	AMD FirePro S9300 X2	AMD Radeon R5 235X OEM
Essentials
Architecture	GCN 3.0	TeraScale 2
Code name	Capsaicin	Caicos
Launch date	31 March 2016	21 December 2013
Launch price (MSRP)	$5,999
Place in performance rating	824	825
Type	Workstation	Desktop
Technical info
Core clock speed	850 MHz	875 MHz
Floating-point performance	2x 6,963 gflops	280.0 gflops
Manufacturing process technology	28 nm	40 nm
Pipelines	2x 4096	160
Texture fill rate	2x 217.6 GTexel / s billion / sec	7 GTexel / s
Thermal Design Power (TDP)	300 Watt	18 Watt
Transistor count	8,900 million	370 million
Video outputs and ports
Display Connectors	No outputs	1x DVI, 1x HDMI
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x16	PCIe 2.0 x16
Length	267 mm	168 mm
Supplementary power connectors	2x 8-pin	None
API support
DirectX	12.0 (12_0)	11.2 (11_0)
OpenGL	4.5	4.4
Memory
Maximum RAM amount	2x 4 GB	1 GB
Memory bandwidth	2x 512.0 GB / s	14.4 GB / s
Memory bus width	2x 4096 Bit	64 Bit
Memory clock speed	1000 MHz	1800 MHz
Memory type	HBM	DDR3