AMD FireStream 9270 vs AMD FireStream 9170

Comparative analysis of AMD FireStream 9270 and AMD FireStream 9170 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark.

 

Differences

Reasons to consider the AMD FireStream 9270

  • Videocard is newer: launch date 1 year(s) 0 month(s) later
  • 2.3x more texture fill rate: 30 GTexel / s vs 12.8 GTexel / s
  • 2.5x more pipelines: 800 vs 320
  • 2.3x better floating-point performance: 1,200.0 gflops vs 512.0 gflops
  • 2.3x more memory clock speed: 3600 MHz vs 1600 MHz
  • 2.1x better performance in PassMark - G3D Mark: 1341 vs 647
Specifications (specs)
Launch date 13 November 2008 vs 8 November 2007
Texture fill rate 30 GTexel / s vs 12.8 GTexel / s
Pipelines 800 vs 320
Floating-point performance 1,200.0 gflops vs 512.0 gflops
Memory clock speed 3600 MHz vs 1600 MHz
Benchmarks
PassMark - G3D Mark 1341 vs 647

Reasons to consider the AMD FireStream 9170

  • Around 7% higher core clock speed: 800 MHz vs 750 MHz
  • Around 52% lower typical power consumption: 105 Watt vs 160 Watt
  • Around 4% better performance in PassMark - G2D Mark: 493 vs 473
Specifications (specs)
Core clock speed 800 MHz vs 750 MHz
Thermal Design Power (TDP) 105 Watt vs 160 Watt
Benchmarks
PassMark - G2D Mark 493 vs 473

Compare benchmarks

GPU 1: AMD FireStream 9270
GPU 2: AMD FireStream 9170

PassMark - G3D Mark
GPU 1
GPU 2
1341
647
PassMark - G2D Mark
GPU 1
GPU 2
473
493
Name AMD FireStream 9270 AMD FireStream 9170
PassMark - G3D Mark 1341 647
PassMark - G2D Mark 473 493

Compare specifications (specs)

AMD FireStream 9270 AMD FireStream 9170

Essentials

Architecture TeraScale TeraScale
Code name RV770 RV670
Launch date 13 November 2008 8 November 2007
Place in performance rating 293 294
Type Desktop Desktop

Technical info

Core clock speed 750 MHz 800 MHz
Floating-point performance 1,200.0 gflops 512.0 gflops
Manufacturing process technology 55 nm 55 nm
Pipelines 800 320
Texture fill rate 30 GTexel / s 12.8 GTexel / s
Thermal Design Power (TDP) 160 Watt 105 Watt
Transistor count 956 million 666 million

Video outputs and ports

Display Connectors 1x DVI 2x DVI, 1x S-Video

Compatibility, dimensions and requirements

Interface PCIe 2.0 x16 PCIe 2.0 x16
Supplementary power connectors 2x 6-pin 1x 6-pin

API support

DirectX 10.1 10.0
OpenGL 3.3 3.3

Memory

Maximum RAM amount 2 GB 2 GB
Memory bandwidth 115.2 GB / s 51.2 GB / s
Memory bus width 256 Bit 256 Bit
Memory clock speed 3600 MHz 1600 MHz
Memory type GDDR5 GDDR3