AMD Radeon RX Vega 64 Liquid vs AMD FirePro M3900

Comparative analysis of AMD Radeon RX Vega 64 Liquid and AMD FirePro M3900 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, Memory, API support, Technologies. Benchmark videocards performance analysis: 3DMark Fire Strike - Graphics Score, Geekbench - OpenCL.

AMD Radeon RX Vega 64 Liquid

AMD FirePro M3900

Differences

Reasons to consider the AMD Radeon RX Vega 64 Liquid

Videocard is newer: launch date 6 year(s) 9 month(s) later
Around 87% higher core clock speed: 1406 MHz vs 750 MHz
2.2x more boost clock speed: 1677 MHz vs 750 MHz
71.6x more texture fill rate: 429.3 GTexel / s vs 6 GTexel / s
25.6x more pipelines: 4096 vs 160
57.2x better floating-point performance: 13,738 gflops vs 240 gflops
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 14 nm vs 40 nm
8x more maximum memory size: 8 GB vs 1 GB
Around 5% higher memory clock speed: 1890 MHz vs 1800 MHz

Launch date	8 August 2017 vs 19 October 2010
Core clock speed	1406 MHz vs 750 MHz
Boost clock speed	1677 MHz vs 750 MHz
Texture fill rate	429.3 GTexel / s vs 6 GTexel / s
Pipelines	4096 vs 160
Floating-point performance	13,738 gflops vs 240 gflops
Manufacturing process technology	14 nm vs 40 nm
Maximum memory size	8 GB vs 1 GB
Memory clock speed	1890 MHz vs 1800 MHz

Reasons to consider the AMD FirePro M3900

11.3x lower typical power consumption: 20 Watt vs 225 Watt

Thermal Design Power (TDP)	20 Watt vs 225 Watt

Compare benchmarks

GPU 1: AMD Radeon RX Vega 64 Liquid
GPU 2: AMD FirePro M3900

Name	AMD Radeon RX Vega 64 Liquid	AMD FirePro M3900
3DMark Fire Strike - Graphics Score	7765
Geekbench - OpenCL		4446

Compare specifications (specs)

	AMD Radeon RX Vega 64 Liquid	AMD FirePro M3900
Essentials
Architecture	GCN 5.0	TeraScale 2
Code name	Vega 10	Seymour
Launch date	8 August 2017	19 October 2010
Place in performance rating	256	1652
Type	Desktop	Mobile workstation
Technical info
Boost clock speed	1677 MHz	750 MHz
Core clock speed	1406 MHz	750 MHz
Floating-point performance	13,738 gflops	240 gflops
Manufacturing process technology	14 nm	40 nm
Pipelines	4096	160
Texture fill rate	429.3 GTexel / s	6 GTexel / s
Thermal Design Power (TDP)	225 Watt	20 Watt
Transistor count		370 million
Video outputs and ports
Display Connectors	1x HDMI, 3x DisplayPort	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x16	PCIe 2.0 x16
Length	267 mm
Supplementary power connectors	2x 8-pin
Bus support		n / a
Form factor		chip-down
Memory
Maximum RAM amount	8 GB	1 GB
Memory bandwidth	483.8 GB / s	14 GB / s
Memory bus width	2048 Bit	64 Bit
Memory clock speed	1890 MHz	1800 MHz
Memory type	HBM2	GDDR3
Shared memory		0
API support
DirectX		11.2 (11_0)
OpenGL		4.4
Technologies
AMD Eyefinity