NVIDIA GeForce GTS 250M vs Intel Graphics Media Accelerator (GMA) 500

Comparative analysis of NVIDIA GeForce GTS 250M and Intel Graphics Media Accelerator (GMA) 500 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, Geekbench - OpenCL.

 

Differences

Reasons to consider the NVIDIA GeForce GTS 250M

  • Videocard is newer: launch date 7 month(s) later
  • 2.5x more core clock speed: 500 MHz vs 200 MHz
  • 24x more pipelines: 96 vs 4
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 130 nm
  • 184.7x better performance in PassMark - G3D Mark: 554 vs 3
Specifications (specs)
Launch date 15 June 2009 vs 1 November 2008
Core clock speed 500 MHz vs 200 MHz
Pipelines 96 vs 4
Manufacturing process technology 40 nm vs 130 nm
Benchmarks
PassMark - G3D Mark 554 vs 3

Reasons to consider the Intel Graphics Media Accelerator (GMA) 500

  • Around 40% better performance in PassMark - G2D Mark: 70 vs 50
Benchmarks
PassMark - G2D Mark 70 vs 50

Compare benchmarks

GPU 1: NVIDIA GeForce GTS 250M
GPU 2: Intel Graphics Media Accelerator (GMA) 500

PassMark - G3D Mark
GPU 1
GPU 2
554
3
PassMark - G2D Mark
GPU 1
GPU 2
50
70
Name NVIDIA GeForce GTS 250M Intel Graphics Media Accelerator (GMA) 500
PassMark - G3D Mark 554 3
PassMark - G2D Mark 50 70
Geekbench - OpenCL 8215

Compare specifications (specs)

NVIDIA GeForce GTS 250M Intel Graphics Media Accelerator (GMA) 500

Essentials

Architecture Tesla 2.0 PowerVR SGX5
Code name GT215 GMA 500
Launch date 15 June 2009 1 November 2008
Place in performance rating 1537 1538
Type Laptop Laptop

Technical info

Core clock speed 500 MHz 200 MHz
CUDA cores 96
Floating-point performance 240 gflops
Gigaflops 360
Manufacturing process technology 40 nm 130 nm
Pipelines 96 4
Texture fill rate 16 GTexel / s
Thermal Design Power (TDP) 28 Watt
Transistor count 727 million

Video outputs and ports

Display Connectors HDMIVGALVDSSingle Link DVIDisplayPortDual Link DVI
HDMI
Maximum VGA resolution 2048x1536

Compatibility, dimensions and requirements

Bus support PCI-E 2.0
Interface PCIe 2.0 x16
Laptop size large
MXM Type MXM 3.0 Type-B
SLI options 2-way

API support

DirectX 10.1 10.1
OpenGL 2.1

Memory

Maximum RAM amount 1 GB
Memory bandwidth 51.2 GB / s
Memory bus width 128 Bit
Memory type DDR3, GDDR3, GDDR5
Shared memory 0 yes

Technologies

CUDA
HybridPower
MXM 3.0 Type-B
Power management 8.0
PowerMizer 8.0
SLI