NVIDIA GeForce GTS 360M vs NVIDIA ION LE

Comparative analysis of NVIDIA GeForce GTS 360M and NVIDIA ION LE videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, Geekbench - OpenCL, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the NVIDIA GeForce GTS 360M

  • Videocard is newer: launch date 1 year(s) 7 month(s) later
  • 3.2x more core clock speed: 1436 MHz vs 450 MHz
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 65 nm
  • 6.7x better performance in PassMark - G3D Mark: 654 vs 98
Specifications (specs)
Launch date 7 January 2010 vs 3 June 2008
Core clock speed 1436 MHz vs 450 MHz
Manufacturing process technology 40 nm vs 65 nm
Benchmarks
PassMark - G3D Mark 654 vs 98

Reasons to consider the NVIDIA ION LE

  • Around 90% lower typical power consumption: 20 Watt vs 38 Watt
  • Around 66% better performance in PassMark - G2D Mark: 96 vs 58
Specifications (specs)
Thermal Design Power (TDP) 20 Watt vs 38 Watt
Benchmarks
PassMark - G2D Mark 96 vs 58

Compare benchmarks

GPU 1: NVIDIA GeForce GTS 360M
GPU 2: NVIDIA ION LE

PassMark - G3D Mark
GPU 1
GPU 2
654
98
PassMark - G2D Mark
GPU 1
GPU 2
58
96
Name NVIDIA GeForce GTS 360M NVIDIA ION LE
PassMark - G3D Mark 654 98
PassMark - G2D Mark 58 96
Geekbench - OpenCL 11217
GFXBench 4.0 - T-Rex (Frames) 3329
GFXBench 4.0 - T-Rex (Fps) 3329

Compare specifications (specs)

NVIDIA GeForce GTS 360M NVIDIA ION LE

Essentials

Architecture Tesla 2.0 Tesla
Code name GT215 ION
Launch date 7 January 2010 3 June 2008
Place in performance rating 1375 1378
Type Laptop Desktop

Technical info

Core clock speed 1436 MHz 450 MHz
CUDA cores 96
Floating-point performance 275.71 gflops
Gigaflops 413
Manufacturing process technology 40 nm 65 nm
Pipelines 96
Texture fill rate 17.6 GTexel / s
Thermal Design Power (TDP) 38 Watt 20 Watt
Transistor count 727 million 282 million

Video outputs and ports

Display Connectors Single Link DVILVDSHDMIDual Link DVIDisplayPortVGA No outputs
HDMI
Maximum VGA resolution 2048x1536

Compatibility, dimensions and requirements

Bus support PCI-E 2.0
Interface MXM-II PCI
Laptop size large
MXM Type MXM 3.0 Type-B
SLI options 2-way
Supplementary power connectors None

API support

DirectX 10.1 10.0
OpenGL 2.1 3.3

Memory

Maximum RAM amount 1 GB
Memory bandwidth 57.6 GB / s
Memory bus width 128 Bit
Memory type DDR3, GDDR3, GDDR5
Shared memory 0

Technologies

CUDA
HybridPower
MXM 3.0 Type-B
Power management 8.0
PowerMizer 8.0
SLI