NVIDIA GeForce GTS 360M vs NVIDIA ION LE
Comparative analysis of NVIDIA GeForce GTS 360M and NVIDIA ION LE videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, Geekbench - OpenCL, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the NVIDIA GeForce GTS 360M
- Videocard is newer: launch date 1 year(s) 7 month(s) later
- 3.2x more core clock speed: 1436 MHz vs 450 MHz
- A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 65 nm
- 6.7x better performance in PassMark - G3D Mark: 654 vs 98
Specifications (specs) | |
Launch date | 7 January 2010 vs 3 June 2008 |
Core clock speed | 1436 MHz vs 450 MHz |
Manufacturing process technology | 40 nm vs 65 nm |
Benchmarks | |
PassMark - G3D Mark | 654 vs 98 |
Reasons to consider the NVIDIA ION LE
- Around 90% lower typical power consumption: 20 Watt vs 38 Watt
- Around 66% better performance in PassMark - G2D Mark: 96 vs 58
Specifications (specs) | |
Thermal Design Power (TDP) | 20 Watt vs 38 Watt |
Benchmarks | |
PassMark - G2D Mark | 96 vs 58 |
Compare benchmarks
GPU 1: NVIDIA GeForce GTS 360M
GPU 2: NVIDIA ION LE
PassMark - G3D Mark |
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PassMark - G2D Mark |
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Name | NVIDIA GeForce GTS 360M | NVIDIA ION LE |
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PassMark - G3D Mark | 654 | 98 |
PassMark - G2D Mark | 58 | 96 |
Geekbench - OpenCL | 11217 | |
GFXBench 4.0 - T-Rex (Frames) | 3329 | |
GFXBench 4.0 - T-Rex (Fps) | 3329 |
Compare specifications (specs)
NVIDIA GeForce GTS 360M | NVIDIA ION LE | |
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Essentials |
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Architecture | Tesla 2.0 | Tesla |
Code name | GT215 | ION |
Launch date | 7 January 2010 | 3 June 2008 |
Place in performance rating | 1375 | 1378 |
Type | Laptop | Desktop |
Technical info |
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Core clock speed | 1436 MHz | 450 MHz |
CUDA cores | 96 | |
Floating-point performance | 275.71 gflops | |
Gigaflops | 413 | |
Manufacturing process technology | 40 nm | 65 nm |
Pipelines | 96 | |
Texture fill rate | 17.6 GTexel / s | |
Thermal Design Power (TDP) | 38 Watt | 20 Watt |
Transistor count | 727 million | 282 million |
Video outputs and ports |
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Display Connectors | Single Link DVILVDSHDMIDual Link DVIDisplayPortVGA | No outputs |
HDMI | ||
Maximum VGA resolution | 2048x1536 | |
Compatibility, dimensions and requirements |
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Bus support | PCI-E 2.0 | |
Interface | MXM-II | PCI |
Laptop size | large | |
MXM Type | MXM 3.0 Type-B | |
SLI options | 2-way | |
Supplementary power connectors | None | |
API support |
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DirectX | 10.1 | 10.0 |
OpenGL | 2.1 | 3.3 |
Memory |
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Maximum RAM amount | 1 GB | |
Memory bandwidth | 57.6 GB / s | |
Memory bus width | 128 Bit | |
Memory type | DDR3, GDDR3, GDDR5 | |
Shared memory | 0 | |
Technologies |
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CUDA | ||
HybridPower | ||
MXM 3.0 Type-B | ||
Power management | 8.0 | |
PowerMizer 8.0 | ||
SLI |