NVIDIA GeForce GTS 360M vs NVIDIA ION LE

Comparative analysis of NVIDIA GeForce GTS 360M and NVIDIA ION LE videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, Geekbench - OpenCL, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

NVIDIA GeForce GTS 360M

NVIDIA ION LE

Differences

Reasons to consider the NVIDIA GeForce GTS 360M

Videocard is newer: launch date 1 year(s) 7 month(s) later
3.2x more core clock speed: 1436 MHz vs 450 MHz
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 40 nm vs 65 nm
6.6x better performance in PassMark - G3D Mark: 651 vs 98

Specifications (specs)
Launch date	7 January 2010 vs 3 June 2008
Core clock speed	1436 MHz vs 450 MHz
Manufacturing process technology	40 nm vs 65 nm
Benchmarks
PassMark - G3D Mark	651 vs 98

Reasons to consider the NVIDIA ION LE

Around 90% lower typical power consumption: 20 Watt vs 38 Watt
Around 60% better performance in PassMark - G2D Mark: 96 vs 60

Specifications (specs)
Thermal Design Power (TDP)	20 Watt vs 38 Watt
Benchmarks
PassMark - G2D Mark	96 vs 60

Compare benchmarks

GPU 1: NVIDIA GeForce GTS 360M
GPU 2: NVIDIA ION LE

PassMark - G3D Mark

GPU 1

GPU 2

651

PassMark - G2D Mark

GPU 1

GPU 2

Name	NVIDIA GeForce GTS 360M	NVIDIA ION LE
PassMark - G3D Mark	651	98
PassMark - G2D Mark	60	96
Geekbench - OpenCL	11217
GFXBench 4.0 - T-Rex (Frames)	3329
GFXBench 4.0 - T-Rex (Fps)	3329

Compare specifications (specs)

	NVIDIA GeForce GTS 360M	NVIDIA ION LE
Essentials
Architecture	Tesla 2.0	Tesla
Code name	GT215	ION
Launch date	7 January 2010	3 June 2008
Place in performance rating	1371	1374
Type	Laptop	Desktop
Technical info
Core clock speed	1436 MHz	450 MHz
CUDA cores	96
Floating-point performance	275.71 gflops
Gigaflops	413
Manufacturing process technology	40 nm	65 nm
Pipelines	96
Texture fill rate	17.6 GTexel / s
Thermal Design Power (TDP)	38 Watt	20 Watt
Transistor count	727 million	282 million
Video outputs and ports
Display Connectors	Single Link DVILVDSHDMIDual Link DVIDisplayPortVGA	No outputs
HDMI
Maximum VGA resolution	2048x1536
Compatibility, dimensions and requirements
Bus support	PCI-E 2.0
Interface	MXM-II	PCI
Laptop size	large
MXM Type	MXM 3.0 Type-B
SLI options	2-way
Supplementary power connectors	None
API support
DirectX	10.1	10.0
OpenGL	2.1	3.3
Memory
Maximum RAM amount	1 GB
Memory bandwidth	57.6 GB / s
Memory bus width	128 Bit
Memory type	DDR3, GDDR3, GDDR5
Shared memory	0
Technologies
CUDA
HybridPower
MXM 3.0 Type-B
Power management	8.0
PowerMizer 8.0
SLI