NVIDIA Quadro FX 3600M vs ATI Radeon X550 XT

Comparative analysis of NVIDIA Quadro FX 3600M and ATI Radeon X550 XT videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the NVIDIA Quadro FX 3600M

  • Videocard is newer: launch date 1 year(s) 0 month(s) later
  • Around 25% higher core clock speed: 500 MHz vs 400 MHz
  • 10x more texture fill rate: 16 GTexel / s vs 1.6 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 65 nm vs 110 nm
  • 4x more maximum memory size: 512 MB vs 128 MB
  • 2.7x more memory clock speed: 1600 MHz vs 600 MHz
  • 8.3x better performance in PassMark - G3D Mark: 467 vs 56
  • Around 63% better performance in PassMark - G2D Mark: 365 vs 224
Specifications (specs)
Launch date 23 February 2008 vs 24 January 2007
Core clock speed 500 MHz vs 400 MHz
Texture fill rate 16 GTexel / s vs 1.6 GTexel / s
Manufacturing process technology 65 nm vs 110 nm
Maximum memory size 512 MB vs 128 MB
Memory clock speed 1600 MHz vs 600 MHz
Benchmarks
PassMark - G3D Mark 467 vs 56
PassMark - G2D Mark 365 vs 224

Compare benchmarks

GPU 1: NVIDIA Quadro FX 3600M
GPU 2: ATI Radeon X550 XT

PassMark - G3D Mark
GPU 1
GPU 2
467
56
PassMark - G2D Mark
GPU 1
GPU 2
365
224
Name NVIDIA Quadro FX 3600M ATI Radeon X550 XT
PassMark - G3D Mark 467 56
PassMark - G2D Mark 365 224
GFXBench 4.0 - T-Rex (Frames) 1820
GFXBench 4.0 - T-Rex (Fps) 1820

Compare specifications (specs)

NVIDIA Quadro FX 3600M ATI Radeon X550 XT

Essentials

Architecture Tesla R400
Code name G92 RV410
Launch date 23 February 2008 24 January 2007
Place in performance rating 776 778
Type Mobile workstation Desktop

Technical info

Core clock speed 500 MHz 400 MHz
Floating-point performance 160 gflops
Manufacturing process technology 65 nm 110 nm
Pipelines 96
Texture fill rate 16 GTexel / s 1.6 GTexel / s
Thermal Design Power (TDP) 70 Watt
Transistor count 754 million 120 million

Video outputs and ports

Display Connectors No outputs 1x DVI, 1x VGA, 1x S-Video
HDCP
HDMI

Compatibility, dimensions and requirements

Interface MXM-HE PCIe 1.0 x16
Laptop size large
Supplementary power connectors None

API support

DirectX 10.0 9.0b
OpenGL 3.3 2.0

Memory

Maximum RAM amount 512 MB 128 MB
Memory bandwidth 51.1 GB / s 9.6 GB / s
Memory bus width 256 Bit 128 Bit
Memory clock speed 1600 MHz 600 MHz
Memory type GDDR3 GDDR3
Shared memory 0

Technologies

Gigathread technology
HDCP-capable
HDR (High Dynamic-Range Lighting)
PCI-E 16x
PowerMizer 7.0