NVIDIA Quadro FX 3600M vs NVIDIA Quadro FX Go1400

Comparative analysis of NVIDIA Quadro FX 3600M and NVIDIA Quadro FX Go1400 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory, Technologies. Benchmark videocards performance analysis: PassMark - G3D Mark, PassMark - G2D Mark, GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the NVIDIA Quadro FX 3600M

  • Videocard is newer: launch date 2 year(s) 11 month(s) later
  • Around 82% higher core clock speed: 500 MHz vs 275 MHz
  • 7.3x more texture fill rate: 16 GTexel / s vs 2.2 GTexel / s
  • A newer manufacturing process allows for a more powerful, yet cooler running videocard: 65 nm vs 130 nm
  • 2x more maximum memory size: 512 MB vs 256 MB
  • 2.7x more memory clock speed: 1600 MHz vs 590 MHz
  • 4.6x better performance in PassMark - G3D Mark: 467 vs 102
  • Around 64% better performance in PassMark - G2D Mark: 365 vs 223
Specifications (specs)
Launch date 23 February 2008 vs 25 February 2005
Core clock speed 500 MHz vs 275 MHz
Texture fill rate 16 GTexel / s vs 2.2 GTexel / s
Manufacturing process technology 65 nm vs 130 nm
Maximum memory size 512 MB vs 256 MB
Memory clock speed 1600 MHz vs 590 MHz
Benchmarks
PassMark - G3D Mark 467 vs 102
PassMark - G2D Mark 365 vs 223

Compare benchmarks

GPU 1: NVIDIA Quadro FX 3600M
GPU 2: NVIDIA Quadro FX Go1400

PassMark - G3D Mark
GPU 1
GPU 2
467
102
PassMark - G2D Mark
GPU 1
GPU 2
365
223
Name NVIDIA Quadro FX 3600M NVIDIA Quadro FX Go1400
PassMark - G3D Mark 467 102
PassMark - G2D Mark 365 223
GFXBench 4.0 - T-Rex (Frames) 1820
GFXBench 4.0 - T-Rex (Fps) 1820

Compare specifications (specs)

NVIDIA Quadro FX 3600M NVIDIA Quadro FX Go1400

Essentials

Architecture Tesla Curie
Code name G92 NV41
Launch date 23 February 2008 25 February 2005
Place in performance rating 813 815
Type Mobile workstation Workstation

Technical info

Core clock speed 500 MHz 275 MHz
Floating-point performance 160 gflops
Manufacturing process technology 65 nm 130 nm
Pipelines 96
Texture fill rate 16 GTexel / s 2.2 GTexel / s
Thermal Design Power (TDP) 70 Watt
Transistor count 754 million 222 million

Video outputs and ports

Display Connectors No outputs No outputs
HDCP
HDMI

Compatibility, dimensions and requirements

Interface MXM-HE MXM-III
Laptop size large

API support

DirectX 10.0 9.0c
OpenGL 3.3 2.1

Memory

Maximum RAM amount 512 MB 256 MB
Memory bandwidth 51.1 GB / s 18.88 GB / s
Memory bus width 256 Bit 256 Bit
Memory clock speed 1600 MHz 590 MHz
Memory type GDDR3 DDR
Shared memory 0

Technologies

Gigathread technology
HDCP-capable
HDR (High Dynamic-Range Lighting)
PCI-E 16x
PowerMizer 7.0