NVIDIA Tesla P100 SXM2 vs AMD FirePro S9300 X2

Comparative analysis of NVIDIA Tesla P100 SXM2 and AMD FirePro S9300 X2 videocards for all known characteristics in the following categories: Essentials, Technical info, Video outputs and ports, Compatibility, dimensions and requirements, API support, Memory. Benchmark videocards performance analysis: Geekbench - OpenCL.

NVIDIA Tesla P100 SXM2

AMD FirePro S9300 X2

Differences

Reasons to consider the NVIDIA Tesla P100 SXM2

Around 56% higher core clock speed: 1328 MHz vs 850 MHz
A newer manufacturing process allows for a more powerful, yet cooler running videocard: 16 nm vs 28 nm
2x more maximum memory size: 16 GB vs 2x 4 GB
Around 41% higher memory clock speed: 1408 MHz vs 1000 MHz
2.7x better performance in Geekbench - OpenCL: 76222 vs 27971

Specifications (specs)
Core clock speed	1328 MHz vs 850 MHz
Manufacturing process technology	16 nm vs 28 nm
Maximum memory size	16 GB vs 2x 4 GB
Memory clock speed	1408 MHz vs 1000 MHz
Benchmarks
Geekbench - OpenCL	76222 vs 27971

Reasons to consider the AMD FirePro S9300 X2

6.7x more texture fill rate: 2x 217.6 GTexel / s billion / sec vs 331.5 GTexel / s
2.3x more pipelines: 2x 4096 vs 3584
Around 31% better floating-point performance: 2x 6,963 gflops vs 10,609 gflops

Texture fill rate	2x 217.6 GTexel / s billion / sec vs 331.5 GTexel / s
Pipelines	2x 4096 vs 3584
Floating-point performance	2x 6,963 gflops vs 10,609 gflops

Compare benchmarks

GPU 1: NVIDIA Tesla P100 SXM2
GPU 2: AMD FirePro S9300 X2

Geekbench - OpenCL

GPU 1

GPU 2

76222

27971

Name	NVIDIA Tesla P100 SXM2	AMD FirePro S9300 X2
Geekbench - OpenCL	76222	27971

Compare specifications (specs)

	NVIDIA Tesla P100 SXM2	AMD FirePro S9300 X2
Essentials
Architecture	Pascal	GCN 3.0
Code name	GP100	Capsaicin
Launch date	5 April 2016	31 March 2016
Place in performance rating	250	852
Type	Desktop	Workstation
Launch price (MSRP)		$5,999
Technical info
Boost clock speed	1480 MHz
Core clock speed	1328 MHz	850 MHz
Floating-point performance	10,609 gflops	2x 6,963 gflops
Manufacturing process technology	16 nm	28 nm
Pipelines	3584	2x 4096
Texture fill rate	331.5 GTexel / s	2x 217.6 GTexel / s billion / sec
Thermal Design Power (TDP)	300 Watt	300 Watt
Transistor count	15,300 million	8,900 million
Video outputs and ports
Display Connectors	No outputs	No outputs
Compatibility, dimensions and requirements
Interface	PCIe 3.0 x16	PCIe 3.0 x16
Supplementary power connectors	None	2x 8-pin
Length		267 mm
API support
DirectX	12.0 (12_1)	12.0 (12_0)
OpenGL	4.6	4.5
Memory
Maximum RAM amount	16 GB	2x 4 GB
Memory bandwidth	720.9 GB / s	2x 512.0 GB / s
Memory bus width	4096 Bit	2x 4096 Bit
Memory clock speed	1408 MHz	1000 MHz
Memory type	HBM2	HBM