Nombre clave de la arquitectura |
Amber Lake Y |
Lakefield |
Fecha de lanzamiento |
Q1'21 |
Q2'20 |
Lugar en calificación por desempeño |
1583 |
1575 |
Processor Number |
i3-10100Y |
i5-L16G7 |
Series |
10th Generation Intel Core i3 Processors |
Intel Core Processors with Intel Hybrid Technology |
Status |
Launched |
Launched |
Segmento vertical |
Mobile |
Mobile |
Precio de lanzamiento (MSRP) |
|
$281 |
Soporte de 64 bits |
|
|
Base frequency |
1.30 GHz |
1.40 GHz |
Bus Speed |
4 GT/s |
4 GT/s |
Tecnología de proceso de manufactura |
14 nm |
10 nm |
Temperatura máxima del núcleo |
100°C |
100°C |
Frecuencia máxima |
3.90 GHz |
3.00 GHz |
Caché L3 |
|
4 MB |
Número de núcleos |
|
5 |
Número de subprocesos |
|
5 |
Canales máximos de memoria |
2 |
|
Máximo banda ancha de la memoria |
33.3 GB/s |
34 GB/s |
Tamaño máximo de la memoria |
16 GB |
8 GB |
Tipos de memorias soportadas |
LPDDR3-1866, DDR3L-1600 |
LPDDR4X 4267 POP Memory |
Supported memory frequency |
|
4267 MHz |
Device ID |
0x591C |
9940 |
Unidades de ejecución |
24 |
64 |
Graphics base frequency |
300 MHz |
200 MHz |
Graphics max dynamic frequency |
1.00 GHz |
500 MHz |
Tecnología Intel® Clear Video HD |
|
|
Tecnología Intel® Clear Video |
|
|
Intel® Quick Sync Video |
|
|
Memoria de video máxima |
16 GB |
|
Procesador gráfico |
Intel UHD Graphics 615 |
Intel UHD Graphics |
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Número de pantallas soportadas |
3 |
4 |
Soporte de resolución 4K |
|
|
Máxima resolución por DisplayPort |
3840x2160@60Hz |
|
Máxima resolución por eDP |
3840x2160@60Hz |
|
DirectX |
12 |
DX12 |
OpenGL |
4.5 |
OpenGL4.5 |
Configurable TDP-down |
3.5 Watt |
|
Configurable TDP-down Frequency |
600 MHz |
|
Configurable TDP-up |
7 Watt |
|
Configurable TDP-up Frequency |
1.60 GHz |
|
Número máximo de CPUs en la configuración |
1 |
1 |
Package Size |
20mm X 16.5mm |
12mm x 12mm |
Diseño energético térmico (TDP) |
5 Watt |
|
Scenario Design Power (SDP) |
|
7 W |
Zócalos soportados |
|
FC-CSP1016 |
Número máximo de canales PCIe |
10 |
6 |
Clasificación PCI Express |
3.0 |
3.0 |
PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
1x2, 1x2 + 2x1 |
Execute Disable Bit (EDB) |
|
|
Tecnología Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Tecnología Intel® Secure Key |
|
|
Tecnología Intel® Trusted Execution (TXT) |
|
|
Tecnología Anti-Theft |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Secure Boot |
|
|
Tecnología Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Instruction set extensions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel SSE4.1, Intel SSE4.2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Tecnología Intel® Hyper-Threading |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Tecnología Intel® Turbo Boost |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|